Process for producing substrate with metal wiring

A manufacturing method and metal wiring technology, applied in the field of substrate manufacturing, can solve the problems of complicated operation and difficulty in forming shapes, and achieve the effect of low-cost productivity

Inactive Publication Date: 2008-10-01
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] However, these methods have disadvantages such as complicated o

Method used

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  • Process for producing substrate with metal wiring
  • Process for producing substrate with metal wiring

Examples

Experimental program
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Example Embodiment

[0104] Example 1

[0105] (1) Preparation of positive photosensitive resin composition

[0106]The following components are mixed to obtain a positive photosensitive resin composition (resist solution), the components are: a mixed cresol of m-cresol / p-cresol (mass mixing ratio=5:5) and formaldehyde in oxalic acid 17.7 parts by mass of novolak resin (weight average molecular weight = about 5500) obtained by polycondensation under the existing conditions, composed of 2,3,4,4'-tetrahydroxybenzophenone and 1,2-naphthoquinonediazide-5 -4.3 parts by mass of a quinonediazide group-containing compound having an esterification rate of 70% by sulfonyl chloride, and a siloxane-based surfactant having a siloxane bond "SH29PA" [東レ·ダウコ一ニング·シリコMade by One Company] 0.05 parts by mass, and 107.4 parts by mass of propylene glycol monomethyl ether acetate (PGMEA).

[0107] (2) Formation of inverted trapezoidal resist pattern

[0108] The resist solution obtained in (1) was coated on a glass substrat...

Example Embodiment

[0113] Examples 2, 3

[0114] The substrates with metal wiring were obtained in the same manner as in Example 1 except that the reaching pressure during the reduced-pressure drying was changed.

[0115] Table 1 shows the evaluation results of the reaching pressure and the treatment time during the reduced-pressure drying treatment, the cross-sectional shape of the resist pattern, and the shape of the metal vapor deposited film pattern after peeling.

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Abstract

The invention provides a process for producing a substrate bearing a metal wiring, which comprises (a) a step in which a positive photosensitive resin composition comprising (A) an alkali-soluble resin, (B) a compound having a quinonediazide group, and (C) a solvent is applied to a substrate to form a coating film, (b) a step in which the coating film is dried under vacuum to form a photosensitive layer, (c) a step in which the photosensitive layer is pattern-wise exposed to light and then developed to form a resist pattern in a reversed taper form, (d) a step in which a metal is vapor-deposited on the substrate having the resist pattern in a reversed taper form obtained in the step (c), and (e) a step in which both of the resist pattern in a reversed taper form and the vapor-deposited metal film formed thereon are removed by a lifting-off operation from the substrate which has undergone metal vapor deposition in the step (d). The target substrate can be inexpensively produced with satisfactory productivity from a substrate having a reversed-taper-form resist pattern obtained from a common positive photoresist.

Description

technical field [0001] The present invention relates to a method of manufacturing a substrate with metal wiring useful in the manufacture of flat panel displays such as liquid crystal displays (LCDs), organic electroluminescence (organic EL) displays, and plasma display panels (PDPs). More specifically, the present invention relates to using a positive-type photosensitive resin composition to obtain a substrate having an inverted trapezoidal resist pattern (Resistopattern), and using the substrate to manufacture the above-mentioned substrate with metal wiring by lift-off method (Liftof method) Methods. Background technique [0002] When metal wiring is formed on a substrate by the lift-off method, a resist material capable of forming an inverted trapezoidal resist pattern in cross-section is generally used. [0003] For example, when forming a conductive pattern by a lift-off method, the conductive pattern is formed on a substrate through a series of steps as follows, that ...

Claims

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Application Information

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IPC IPC(8): G03F7/26G03F7/022G03F7/16H01L21/027H05K3/02
CPCH05K3/048G03F7/0007G03F7/405H05K2203/0594
Inventor 牛岛知彦藤野竹生
Owner ZEON CORP
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