Electrostatic-resistant heat conducting plastic

A thermally conductive plastic and antistatic technology, applied in the field of thermally conductive materials, can solve the problems of easy generation of static electricity, large equipment wear, equipment failure, etc., and achieve the effect of preventing static electricity accumulation, small equipment wear and low cost.

Inactive Publication Date: 2008-10-08
东莞金富亮塑胶颜料有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the thermal conductivity is low, the working temperature is low, the hardness of the filler is high, the wear and tear on the equipment is large, and it is easy to generate static electricity
The generation of static electricity has brought many troubles, such as electrostatic discharge, which harms electronic equipment through discharge radiation, electrostatic induction, electromagnetic induction and conductive coupling, causing various failures of the equipment and shortening the service life

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] An antistatic heat-conducting plastic, which consists of the following components in parts by weight,

[0027] Polyphenylene sulfide 59%

[0028] Zinc sulfide 40%

[0029] Silane coupling agent 0.5%

[0030] Modified Ethylene Bis Fatty Acid Amide 0.5%.

[0031] A preparation method of an antistatic thermally conductive plastic comprises the following steps:

[0032] (1) 400Kg particle size distribution is earlier: 50 microns account for 30%, 400 microns account for 70% of zinc sulfide and 5Kg silane coupling agent to add in the high-speed mixer, mix at a temperature of 100 ° C;

[0033] (2) Add 590Kg polyphenylene sulfide and 5Kg modified ethylene bis fatty acid amide dispersant to the high-speed machine and mix,

[0034] (3) The mixture is then transferred to an extruder, extruded and granulated at a temperature of 290° C.; that is, an antistatic heat-conducting plastic is obtained.

Embodiment 2

[0036] An antistatic heat-conducting plastic, which consists of the following components in parts by weight,

[0037] Polyphenylene sulfide 48.9%

[0038] Zinc sulfide 50%

[0039] Aluminate coupling agent 0.5%

[0040] Modified Ethylene Bis Fatty Acid Amide 0.6%.

[0041] A preparation method of an antistatic thermally conductive plastic comprises the following steps:

[0042] (1) First, 500Kg particle size distribution is: 1 micron accounts for 30%, 100 micron accounts for 70% zinc sulfide and 5Kg aluminate coupling agent are added in the high-speed mixer, and mixed at a temperature of 80°C;

[0043] (2) Add 489Kg polyphenylene sulfide and 6Kg modified ethylene bis fatty acid amide dispersant to the high-speed machine and mix,

[0044] (3) The mixture is then transferred to an extruder, extruded and granulated at a temperature of 280° C.; that is, an antistatic heat-conducting plastic is obtained.

Embodiment 3

[0046] An antistatic heat-conducting plastic, which consists of the following components in parts by weight,

[0047] Polyphenylene sulfide 38.8%

[0048] Zinc sulfide 60%

[0049] Titanate coupling agent 0.5%

[0050] Modified Ethylene Bis Fatty Acid Amide 0.7%.

[0051] A preparation method of an antistatic thermally conductive plastic comprises the following steps:

[0052] (1) First, 600Kg particle size distribution is: 10 microns account for 30%, 150 microns account for 70% zinc sulfide and 5Kg titanate coupling agent are added in a high-speed mixer, and mixed at a temperature of 90°C;

[0053] (2) Add 388Kg polyphenylene sulfide and 7Kg modified ethylene bis fatty acid amide dispersant to the high-speed machine and mix,

[0054] (3) The mixture is then transferred to an extruder, extruded and granulated at a temperature of 280° C.; that is, an antistatic heat-conducting plastic is obtained.

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PUM

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Abstract

The invention relates to the technical field of thermal conductive materials, particularly to an anti-static thermal conductive plastic, comprising the following components based on weight proportion: 30-70% of plastic substrate, 40-75% of filler, 0.1-1% of coupling agent and 0.1-1% of dispersant; the filler is zinc sulfide, which has low hardness and small abrasion to equipment; the plastic of the invention can be applied to a plurality of electronic isolation boards, semiconductor equipment casings and outer shells of mobile communication devices and can effectively prevent electronic components being damaged by static accumulation and graft, which is an anti-static thermal conductive plastic.

Description

Technical field: [0001] The invention relates to the technical field of heat-conducting materials, in particular to an antistatic heat-conducting plastic. Background technique: [0002] In the field of electronic technology, due to the increasing integration of electronic circuits, the accumulation of heat is increasing. The accumulation of heat causes the temperature of the device to rise and the working stability to decrease. According to the Arhennius formula, for every 10°C increase in temperature, the life of the processor is reduced by half. Therefore, the material used for the processor is required to have high thermal conductivity, so that the heat can be conducted out quickly to achieve the purpose of cooling. For highly integrated chips, the design heat energy is so high that it is difficult for ordinary heat sinks to ensure effective heat dissipation. For devices that require heat conduction, high heat conduction ceramics, such as aluminum nitride and boron nitr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L81/02C08K3/30C08K5/54C08K5/00C08K5/20B29B9/12B29C47/92C09K5/00B29C48/92
CPCB29C47/92
Inventor 朱未冽李卫覃碧勋唐敬海柯金成
Owner 东莞金富亮塑胶颜料有限公司
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