Thermosetting epoxy resin composition and semiconductor device

A technology of epoxy resin and composition, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problem of yellowing of epoxy resin composition, and achieve excellent curability, uniform good strength effect

Active Publication Date: 2011-05-11
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, as the epoxy resin, it is described that bisphenol A type epoxy resin or bisphenol F type epoxy resin is mainly used, and triglycidyl isocyanate and the like may also be used, but triglycidyl isocyanate Esters are added in a small amount in the examples and used in bisphenol-type epoxy resins. According to the research of the present inventors, the epoxy resin composition for B-stage semiconductor encapsulation has the tendency to turn yellow especially at high temperature and long-term storage. question
[0006] In addition, regarding the use of the triazine derivative epoxy resin in the epoxy resin composition for encapsulating light-emitting elements, there are JP-A-2000-196151 (Patent Document 2) and JP-A-2003-224305 (Patent Document 3) , Japanese Patent Application Laid-Open No. 2005-306952 (Patent Document 4), but none of these patents use a solid obtained by reacting a triazine derivative epoxy resin with an acid anhydride.

Method used

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  • Thermosetting epoxy resin composition and semiconductor device
  • Thermosetting epoxy resin composition and semiconductor device
  • Thermosetting epoxy resin composition and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0085] Preparation method of epoxy resin composition

[0086] As a method for preparing the epoxy resin composition of the present invention as a molding material, (A), (B) components, preferably (A), (B), and (C) components are mixed in advance, and the A temperature range of 70 to 120°C, preferably 80 to 110°C, or each component of (A), (B), (D) or (A), (B), (C), (D) in advance Mixing is carried out at a temperature range of 30 to 80°C, preferably 40 to 60°C, using a device such as a reactor that can be heated without a solvent to uniformly melt and mix, and the mixture must be viscosified to a sufficient softening point for use at normal temperature. Specifically, the epoxy resin is cooled at 50 to 100° C., more preferably 60 to 90° C., to obtain a solidified mixture.

[0087] In this case, the temperature range for mixing these components is preferably 70 to 120° C., and more preferably 80 ~ 110 ℃ range. When the mixing temperature is lower than 70°C, the temperature ...

Embodiment 1～4、 comparative example 1、2

[0116] Among the components shown in Table 1, the (reaction) components were melt-mixed under the conditions shown in the table, and the obtained reaction solids were pulverized, and this was used as a (post-blending) component to obtain an epoxy resin composition.

[0117] Properties of the above-mentioned reaction solids and cured products obtained by curing the above-mentioned epoxy resin compositions with a transfer molding machine were investigated by the following methods. The results are summarized in Table 1.

[0118] Reaction solids

[0119] The reaction solids were subjected to GPC analysis under the following conditions.

[0120] (GPC analysis conditions)

[0121] Using HLC-8120 (device manufactured by Tosoh Corporation), on the column: TSKguardcolumnHXL-L+G4, 3, 2, 2HxL, sample concentration 0.2%, injection volume 50μL, mobile phase THF 100%, flow rate 1.0mL / min, temperature Under the condition of 40°C, the measurement was performed with detector RI.

[0122]...

Embodiment 1

[0143] The reaction solids of embodiment 1

[0144] X 51.6

[0145] Y 16.2

[0146] Z 27.0

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Abstract

A thermosetting epoxy resin composition characterized by containing as a resin ingredient a product of pulverization of a solid matter obtained by reacting a triazine derivative / epoxy resin with an acid anhydride in such a proportion that the amount of the epoxy groups is 0.6-2.0 equivalents to the acid anhydride groups.

Description

technical field [0001] The present invention relates to a thermosetting epoxy resin composition that is excellent in curability, excellent in heat resistance and light resistance, has good strength, suppresses discoloration due to heat, especially yellowing, and is excellent in reliability, and uses the composition The cured product is a semiconductor device that encapsulates semiconductor elements such as light-receiving elements (excluding light-emitting elements such as LED elements, but including photocouplers that integrate light-emitting elements and light-receiving elements). Background technique [0002] Reliability requirements for packaging materials of semiconductor-electronic devices have become increasingly strict due to thinning, miniaturization, and higher output. As an example, semiconductor elements such as LEDs and LDs (laser diodes) are small and efficiently emit brightly colored light. Also, since they are semiconductor elements, there is no need to worry...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/20H01L23/29H01L23/31
CPCC08G59/3245C08G59/42C08L63/00H01L23/293H01L2224/48091H01L2224/48247H01L2924/12044Y10T428/239H01L2924/00014H01L2924/00C08G59/20H01L23/29H01L23/31
Inventor 青木贵之盐原利夫
Owner SHIN ETSU CHEM CO LTD
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