Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing method of insulation heat-conducting metal substrate

A technology of metal substrates and manufacturing methods, applied in the direction of metal material coating technology, superimposed layer plating, gaseous chemical plating, etc., to achieve the effect of quantitative control

Inactive Publication Date: 2010-12-01
MITAC PRECISION TECH(KUNSHAN) CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no method on the market to prepare insulating and heat-conducting metal substrates by using a novel thin film coating technology combining plasma chemical vapor deposition (PCVD) and reactive colloid coating.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of insulation heat-conducting metal substrate
  • Manufacturing method of insulation heat-conducting metal substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a production method of an insulating and heat-conducting metallic parent material, which comprises the following steps: (1) a metallic parent material is provided and placed into a plasma reaction chamber; (2) a gas mixture with mixed high-erosiveness gas is let into the plasma reaction chamber, and the surface of the metallic parent material is eroded irregularly, thus forming the material with nano-level surface roughness; and (3) the chemical vapor deposition of plasmas is implemented in the plasma reaction chamber, free radical plasmas are generated, and multiple highly heat-conducting coating layers are formed on the surface of the metallic parent material; (4) coating is carried out with a layer of highly heat-conducting and insulating gum. The production method of the insulating and heat-conducting metallic parent material can implement even plating on any metallic substrates with any surface state and realize the quantitative control of heat conductivity.

Description

Manufacturing method of insulating and heat-conducting metal substrate 【Technical field】 The invention relates to a method for manufacturing an insulating and heat-conducting metal substrate, in particular to a method for manufacturing an insulating and heat-conducting metal substrate that can uniformly coat metal substrates in any surface state. 【Background technique】 A good insulating and thermally conductive substrate must have high thermal conductivity, insulation, and low expansion coefficient. One of the traditional preparation methods of insulating and thermally conductive substrates is to print copper foil circuits on plastic substrates such as FR4 printed circuit substrates (PCBs), whose thermal conductivity (K) is about 0.36W / m K, and its disadvantage is that the thermal performance poor. The second preparation method of the insulating and heat-conducting base material is to attach a metal plate such as an aluminum base material to the PCB base material, which...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C28/00C23C16/513C23C16/02C23F4/00C23C16/448
Inventor 吴政道胡振宇郭雪梅
Owner MITAC PRECISION TECH(KUNSHAN) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com