Manufacturing method of insulation heat-conducting metal substrate

Abstract

The invention discloses a production method of an insulating and heat-conducting metallic parent material, which comprises the following steps: (1) a metallic parent material is provided and placed into a plasma reaction chamber; (2) a gas mixture with mixed high-erosiveness gas is let into the plasma reaction chamber, and the surface of the metallic parent material is eroded irregularly, thus forming the material with nano-level surface roughness; and (3) the chemical vapor deposition of plasmas is implemented in the plasma reaction chamber, free radical plasmas are generated, and multiple highly heat-conducting coating layers are formed on the surface of the metallic parent material; (4) coating is carried out with a layer of highly heat-conducting and insulating gum. The production method of the insulating and heat-conducting metallic parent material can implement even plating on any metallic substrates with any surface state and realize the quantitative control of heat conductivity.

Description

Manufacturing method of insulating and heat-conducting metal substrate 【Technical field】 The invention relates to a method for manufacturing an insulating and heat-conducting metal substrate, in particular to a method for manufacturing an insulating and heat-conducting metal substrate that can uniformly coat metal substrates in any surface state. 【Background technique】 A good insulating and thermally conductive substrate must have high thermal conductivity, insulation, and low expansion coefficient. One of the traditional preparation methods of insulating and thermally conductive substrates is to print copper foil circuits on plastic substrates such as FR4 printed circuit substrates (PCBs), whose thermal conductivity (K) is about 0.36W / m K, and its disadvantage is that the thermal performance poor. The second preparation method of the insulating and heat-conducting base material is to attach a metal plate such as an aluminum base material to the PCB base material, which...

AI Technical Summary

Problems solved by technology

At present, there is no method on the market to prepare insulating and heat-conducting metal substrates by using a novel thin film coating technology combining plasma chemical vapor deposition (PCVD) and reactive colloid coating.

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