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Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method

A technology of LED packaging and inkjet printing, applied in chemical instruments and methods, luminescent materials, semiconductor devices, etc., can solve the problems of uneven thickness structure of phosphor layer, restricting mass production and yield, poor repeatability of phosphor thickness, etc. , to achieve the effect of improving the structure and physicochemical properties and improving the overall performance

Inactive Publication Date: 2010-06-02
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this phosphor-converted white LED, the current mainstream process is to mix phosphor particles with transparent colloid (such as epoxy glue, silica gel, etc.), and apply a mixed layer of phosphor powder and colloid on the LED chip by dispensing glue. , but the thickness structure of the phosphor layer obtained in this way is not uniform, resulting in poor uniformity of LED light output, and poor repeatability of phosphor thickness between devices, which greatly restricts mass production and yield

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Take 1ml each of silica gel A and silica gel B, stir evenly to form a mixed silica gel, let it stand for about 10 hours, and wait for the bubbles in it to disappear completely; measure a certain amount of tetrahydrofuran organic solvent, and stir to reduce the viscosity of the silica gel from the original about 400mPa·s 10~12mPa·s or even below; weigh 500mg of fluorescent powder, mix it with the diluted mixed silica gel, stir evenly, and form a dispersion of fluorescent powder and resin with an appropriate viscosity suitable for inkjet printing; through the inkjet printing time , inkjet path and other parameters are controlled to form a phosphor layer with controllable shape and thickness on the surface of the LED chip.

Embodiment 2

[0033] Take 1ml each of silica gel A and silica gel B, stir evenly to form a mixed silica gel, let it stand for about 10 hours, and wait for the bubbles in it to disappear completely; take a certain amount of ethyl acetate organic solvent, and stir to make the viscosity of the silica gel from the original about 400mPa. s is reduced to 10-12mPa·s or even below; weigh 500mg of fluorescent powder, mix it with the diluted mixed silica gel, stir evenly, and form a dispersion of fluorescent powder and resin suitable for inkjet printing; The control of parameters such as printing time and inkjet path forms a phosphor layer with controllable shape and thickness on the surface of the LED chip.

Embodiment 3

[0035] Take 1ml of epoxy resin and its curing agent, and mix evenly; weigh 500mg of fluorescent powder, add it to the prepared epoxy resin, and stir evenly; take a certain amount of tetrahydrofuran organic solvent, mix and stir to make the fluorescent powder epoxy resin The viscosity of the dispersion is reduced to 10-12mPa·s to form a dispersion of phosphor powder and resin with an appropriate viscosity suitable for inkjet printing, and form a shape on the surface of the LED chip by controlling parameters such as inkjet printing time and inkjet path , Phosphor layer with controllable thickness.

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PUM

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Abstract

The invention discloses a preparation for the fluorescent powder dispersoid for the LED package and a ink-jet printing method, comprising the following steps: (1) preparing the resin: mixing the resinand the firming agent with a proper volume proportion; (2) diluting the resin: mixing the resin with high adhesive prepared in the step (1) to the ether or ester organic solvent with proper proportion, reducing the adhesive of the resin; (3) preparing the fluorescent powder and dispersoid: mixing the fluorescent powder with the resin diluted by the step (2) with a proper proportion , dispersing evenly to form the fluorescent powder dispersoid; (4) ink-jet printing package: loading the fluorescent powder dispersoid with the qualified adhesive prepared in the step (3) in the ink-jet printing head, achieving a resin covering, which is a fluorescent powder layer, with shape and thickness controllable resin covering on the LED chip surface via the control for the ink-jet time and the ink-jet path for the ink-jet printer. The method overcomes the defects in the current packaging technology, which can effectively enhance the integral performance for the LED devices and satisfy the requestsof industrialized volume-produce.

Description

technical field [0001] The invention relates to the application field of optoelectronic technology, in particular to a method for preparing a fluorescent powder dispersion used for LED packaging and an inkjet printing method. Background technique [0002] LED is the abbreviation of light emitting diode. Since the world's first red light-emitting diode came out, LED technology has experienced a rapid development process, and LEDs of various luminous colors have been born one after another. In 1993, Japan first achieved technological breakthroughs in blue GaN-LEDs, and realized white LEDs in 1996. In recent years, the research and development of semiconductor lighting technology, the fourth generation of lighting technology represented by white LEDs, has attracted worldwide attention. a high degree of attention. White LED has the advantages of no pollution, low power consumption, high reliability, long life, etc. It is a green lighting source that meets environmental protect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00C09K3/10C09K11/00
Inventor 饶海波李君飞侯斌胡玥卢志云谢明贵
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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