Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micro hollow silicon needle and preparation method thereof

A hollow silicon, micro-technology, applied in the field of medical and semiconductor micro-processing, can solve the problems of micro-needle structure difficult to penetrate the skin, leaking transdermal drug delivery, easy to break, etc., to achieve simple manufacturing process, strong structure, short production cycle short effect

Inactive Publication Date: 2008-12-31
TSINGHUA UNIV
View PDF0 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the process of realizing the present invention, the inventors have found that there are at least the following problems in the prior art: in the prior art, the hole spacing of the hole arrays produced by the electrochemical corrosion technology is very small (usually less than 30 microns), and all obtained is a very dense array of holes
If it is simply transplanted for the preparation of the hole array in the microneedle array for transdermal drug delivery, on the one hand, the microneedle structure will be very fragile, difficult to penetrate the skin and easy to break, and on the other hand, it will cause serious leakage and it is difficult to realize it. transdermal administration

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micro hollow silicon needle and preparation method thereof
  • Micro hollow silicon needle and preparation method thereof
  • Micro hollow silicon needle and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0037] Such as Figure 1a ~ Figure 3b Shown, the embodiment of the present invention provides a kind of micro hollow silicon needle, the needle head of described micro hollow silicon needle is pyramid-shaped, can be octagonal pyramid (referring to Figure 1a with Figure 1b ) or quadrangular pyramid (refer to Figure 3a with Figure 3b ). There are through holes perpendicular to the silicon wafer substrate on the needle tip or the side wall of the microneedle. The diameter of the through hole at different positions may vary, and there may be short branch holes. Whether there are branch holes and the existence of branches The specific shape and quantity of the holes dep...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Sizeaaaaaaaaaa
Depthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a tiny hollow silicon probe, the needle of which takes the shape of a pyramid. A needlepoint or the side wall of a microneedle has a through hole which is vertical to a silicon substrate. The height of the tiny hollow silicon probe is 100-600 micron. The diameter of the through hole is larger than 5 micron. The invention also discloses a preparation method of the tiny hollow silicon probe which comprises that: a hole or hole arrays with the depth reaching or being close to the thickness of the silicon are processed through a method of anisotropy chemical etch on the reverse side of monocrystalline silicon chips on crystal orientation; on the positive side of the silicon, by adopting an anisotropy wet chemistry etch method, a pyramid-shaped tiny silicon probe is processed and the through hole which is connected with the reverse side of the silicon is exposed. The tiny hollow silicon probe array prepared by the invention not only has stable structure, but also is simple in manufacture technology, short in manufacture cycle, low in cost, high in the rate of finished products and good in repetitiveness.

Description

technical field [0001] The invention relates to the technical fields of medical treatment and semiconductor microprocessing, in particular to a micro hollow silicon needle and a preparation method thereof. Background technique [0002] Human skin has three layers of tissue: stratum corneum, active epidermis and dermis. The thickness of the outermost stratum corneum is about 10-50 microns, which is composed of dense corneocytes; below the stratum corneum is the epidermis, which is about 50-100 microns in thickness, contains active cells and a small amount of nerve tissue, but has no blood vessels . Below the epidermis is the dermis, which is the main component of the skin and contains a large number of living cells, nerve tissue, and blood vessel tissue. Since the outer diameter of the injection needle used in the traditional hypodermic injection method is generally 0.4 to 3.4 mm, the injection needle needs to penetrate the surface layer of the skin and go deep under the sk...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): A61M5/32A61M5/158A61M37/00A61B17/32H01L21/3063H01L21/00B81C1/00
CPCA61M37/0015A61M2037/003
Inventor 岳瑞峰祁睿
Owner TSINGHUA UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products