Low-temperature energy-saving leadless solder paste special for tuners
A lead-free solder paste, tuner technology, applied in the direction of welding medium, welding/cutting medium/material, metal processing equipment, etc., can solve problems such as excessive solder paste drop, short circuit, reliability hazards, etc., to achieve qualified The effect of rate and safety performance
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Embodiment 1
[0025] A low-temperature energy-saving lead-free solder paste for tuner production, the components and proportions of which are prepared according to the following methods.
[0026] (1) Preparation of solder paste:
[0027] High Viscosity Tetrahydro Rosin 30% Ammonium Succinate 2.0%
[0028] Low viscosity Tetrahydrorosin 25% Cyclohexylamine Hydrobromide 0.3%
[0029] Modified hydrogenated castor oil 3% Diethylene glycol ether solvent 39.7%
[0030] Put the above materials into a stainless steel reactor, stir, heat to 130°C to dissolve at a constant temperature, and then rapidly cool to room temperature. Then move it into the refrigerator, let it stand at 0-5°C for 24 hours, thaw it to room temperature for 4 hours, grind it in a three-roll machine, and set it aside.
[0031] (2) Solder paste preparation:
[0032] Soldering paste: 11% Sn42Bi58 tin powder: 89%
[0033] Fully knead in a double planetary kneader for 30 minutes under the condition of evacuating and filling with...
Embodiment 2
[0036] A low-temperature energy-saving lead-free solder paste for tuner production, the components and proportions of which are prepared according to the following methods.
[0037] (1) Preparation of solder paste:
[0038] High Viscosity Tetrahydrorosin 39% Ammonium Succinate 4.0%
[0039] Low viscosity Tetrahydrorosin 15% Cyclohexylamine Hydrobromide 0.6%
[0040] Modified hydrogenated castor oil 6% Diethylene glycol ether solvent 35.4%
[0041] Manufacturing method is the same as embodiment 1.
[0042] (2) Solder paste preparation:
[0043] Soldering paste: 11% Sn42Bi58 tin powder: 89%
[0044] Manufacturing method is the same as embodiment 1.
[0045] When the prepared solder paste is used in the assembly and welding process of the tuner circuit board, the amount of solder paste falling during the installation process of the plug-in components is very small; there are no tin beads in the flux residue.
Embodiment 3
[0047] A low-temperature energy-saving lead-free solder paste for stencil printing produced by a tuner, the composition and proportion of which are prepared according to the following method.
[0048] (1) Preparation of solder paste:
[0049] High Viscosity Tetrahydro Rosin 35% Ammonium Succinate 3.0%
[0050] Low viscosity Tetrahydrorosin 20% Cyclohexylamine Hydrobromide 0.5%
[0051] Modified hydrogenated castor oil 5% Diethylene glycol ether solvent 36.5%
[0052] Manufacturing method is the same as embodiment 1.
[0053] (2) Solder paste preparation:
[0054] Soldering paste: 11% Sn42Bi58 tin powder: 89%
[0055] Manufacturing method is the same as embodiment 1.
[0056] (3) Performance test
[0057] Viscosity: 192Pa.s, TI value: 0.52, viscosity non-recovery rate: 1.8%,
[0058] Viscosity: 118gf
[0059] Tin bead test on ceramic sheet: no tin bead.
[0060] When the prepared solder paste is used in the tuner circuit board assembly stencil printing and welding proc...
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Abstract
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