Semiconductor discharged-gas processing device

Abstract

The invention provides a semiconductor exhaust gas treatment device. The device can efficiently, safely and reliably decompose the semiconductor exhaust gas containing PFCs, and causes the gas to be innoxious. The semiconductor exhaust gas treatment device of the invention is provided with a wet inlet scrubber (12), a reaction furnace (14), a wet outlet scrubber (16) and an exhaust fan (18); the wet inlet scrubber is connected with a chamber of a semiconductor making device by an inlet pipe (22), and washes semiconductor exhaust gas (X) discharged from the chamber by the water injected from a jet nozzle (12b); the reaction furnace carries out decomposition treatment on the semiconductor exhaust gas which is washed by the inlet scrubber by the heat generated by an electric heater (34); the wet outlet scrubber washes and cools the treated semiconductor exhaust gas which is thermally oxidized and decomposed in the reaction furnace; the exhaust fan is arranged at the downstream end of the outlet scrubber along the gas flow direction, and attracts and exhausts the semiconductor exhaust gas.

Description

technical field [0001] The present invention relates to a semiconductor exhaust gas treatment device for thermally oxidizing and decomposing semiconductor exhaust gas harmful to human bodies or the environment discharged from semiconductor manufacturing equipment to make it harmless. Background technique [0002] In semiconductor manufacturing equipment, various fluorine compound gases (gas) are used as cleaning gas or etching gas. Such fluorine compounds are called "PFCs (perfluoro-compounds)", and as its representative, perfluorocarbon (perfluorocarbon, for example: CF 4 、C 2 f 6 、C 3 f 8 、C 4 f 8 、C 5 f 8 etc.), hydrofluorocarbons (e.g. CHF 3 etc.), and inorganic fluorides (for example: SF 6 or NF 3 wait. [0003] Moreover, various PFCs used in semiconductor manufacturing equipment, and nitrogen (N 2 ) or argon (Ar), or oxygen (O 2 ), hydrogen (H 2 ), ammonia (NH 3 ), methane gas (CH 4 ) etc. are discharged together as semiconductor exhaust gas. [0004]...

AI Technical Summary

Problems solved by technology

In this case, if dust or the like is contained in the semiconductor exhaust gas, the dust may accumulate in the supply passage and block it, and as a result, there may be a problem that the combustion treatment of the semiconductor exhaust gas may not be performed.

[0008] Moreover, hydrogen gas (H 2 ) such flammable gas, there is a possibility that a flashback phenomenon (that is, a phenomenon in which a flame propagates toward a semiconductor manufacturing device that is a source of semiconductor exhaust gas due to combustion of oxygen) or an explosion may occur

[0009] Furthermore, although there is no problem as long as the type or amount of the semiconductor exhaust gas discharged from the semiconductor manufacturing equipment is always constant, when the semiconductor exhaust gas is intermittently discharged from the semiconductor manufacturing equipment, the pressure inside the semiconductor exhaust gas treatment device will be generated. Changes, such changes may have adverse effects on semiconductor manufacturing equipment

Moreover, when the semiconductor off-gas is intermittently discharged from the semiconductor manufacturing apparatus or when different types of semiconductor off-gas are discharged, there is a problem that the flame of combustion is unstable and causes the flame to disappear, or even if the flame does not Disappearance also causes temperature instability inside the combustion chamber, making it difficult to reliably decompose semiconductor exhaust gases

[0010] Moreover, since the humidity of the gas exhausted into the atmosphere through the wet tower is high, condensation will occur in the exhaust duct connected to the atmosphere, and the condensation will cause corrosion or deformation of the exhaust duct. slime

Therefore, frequent large-scale maintenance (maintenance) including exhaust pipes is necessary, and it is difficult to improve the operating efficiency of semiconductor exhaust gas treatment equipment and semiconductor production efficiency.

Images