Stable dimension type polyimide film and preparation method thereof

A polyimide film and dimensional stability technology, applied in the field of dimensionally stable polyimide film and its preparation, can solve the problems of reducing international competitiveness and high production cost, and achieve strong market competitiveness and production cost. reduced effect

Active Publication Date: 2009-02-04
无锡高拓新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the late start of research on dimensionally stable polyimide films in my country, almost all domestic FPC manufacturers use imported products from Japan and the United States, resulting in high production costs and reduced international competitiveness.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Preparation of component A: at 50°C, in dimethylacetamide (DMAC) solvent, mix 5mol biphenyltetracarboxylic dianhydride (BPDA), 5mol pyromellitic dianhydride (PMDA) and 10mol p-phenylenediamine (PDA) carried out regular block copolymerization, the weight of dimethylacetamide (DMAC) accounted for 80% of the whole reaction material weight, reacted for 6 hours, and effectively controlled the weight average molecular weight of polymer at 3 * 10 4 ~1×10 5 between;

[0023] Preparation of component B: Copolymerize 5 mol of pyromellitic dianhydride (PMDA) and 5 mol of p-phenylenediamine (PDA) in dimethylacetamide (DMAC) solvent at 50°C, dimethylacetamide The weight of (DMAC) accounts for 80% of whole reaction mass weight, reacts 8 hours, effectively controls the weight average molecular weight of polymkeric substance at 3 * 10 4 ~1×10 5 between;

[0024] Preparation of component C: at 50°C, in dimethylacetamide (DMAC) solvent, mix 10mol pyromellitic dianhydride (PMDA) with ...

Embodiment 2

[0028] Preparation of component A: at 20°C, in dimethylacetamide (DMAC) solvent, mix 3mol biphenyltetracarboxylic dianhydride (BPDA), 6mol pyromellitic dianhydride (PMDA) and 9mol p-phenylenediamine (PDA) carried out regular block copolymerization, the weight of dimethylacetamide (DMAC) accounted for 90% of the whole reaction material weight, reacted for 8 hours, and effectively controlled the weight average molecular weight of polymer at 3 * 10 4 ~1×10 5 between;

[0029] Preparation of component B: Copolymerize 6 mol of pyromellitic dianhydride (PMDA) and 6 mol of p-phenylenediamine (PDA) in dimethylacetamide (DMAC) solvent at 70°C, dimethylacetamide The weight of (DMAC) accounts for 80% of whole reaction material weight, reacts 7 hours, effectively controls the weight-average molecular weight of polymkeric substance at 3 * 10 4 ~1×10 5 between;

[0030] Preparation of component C: at 20°C, in dimethylacetamide (DMAC) solvent, mix 9mol pyromellitic dianhydride (PMDA) wit...

Embodiment 3

[0034] The dimensionally stable polyimide film prepared in Example 1 was compared with the ordinary polyimide film and the dimensionally stable NPI polyimide film of Japan Kanebuchi Chemical Co., Ltd. for the same specifications. The results are shown in Table 1.

[0035] Table 1 Comparison of characteristics between ordinary polyimide film and dimensionally stable polyimide film

[0036]

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PUM

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Abstract

The invention discloses a dimension stable polyimide film, which contains the following components: component A: copolymer of biphenyl tetracarboxylic acid dianhydride, pyromellitic dianhydride and p-phenylenediamine in dimethyl acetamide solvent; component B: copolymer of pyromellitic dianhydride and p-phenylenediamine in dimethyl acetamide solvent; copolymer of pyromellitic dianhydride and p-phenylenediamine, 4, 4'-diaminodiphenyl ether in dimethyl acetamide solvent; wherein, the weight percent of the component A is 20 to 50 percent; the weight percent of the component B is 5 to 20 percent; the weight percent of the component C is 30 to 60 percent; the invention also discloses a preparation method of the dimension stable polyimide film. The dimension stable polyimide film of the invention has high tensile elastic modulus, low thermal expansion coefficient, low shrinkage rate and good dimensional stability, and is mainly used as a substrate of flexible circuit FPC and achieves high performance of FPC.

Description

technical field [0001] The invention relates to the technical field of polyimide films, in particular to a dimensionally stable polyimide film and a preparation method thereof. Background technique [0002] With the advancement and high density of integrated circuit (IC) mounting technology, the development of miniaturization of flexible circuit board (FPC) wiring has been accelerated. To achieve the ultimate stability, for this reason, on the basis of the original excellent comprehensive properties such as radiation resistance, heat and cold resistance, and insulation reliability, the product should also reflect the high dimensional stability of this polyimide film , its performance shows low thermal shrinkage, low thermal expansion coefficient, or the same thermal expansion coefficient and high modulus as copper foil. [0003] In recent years, my country's FPC field has developed rapidly, and product performance has continued to develop towards high functionality. Ordinar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08J5/18B29C69/02B29L7/00
Inventor 沈国强
Owner 无锡高拓新材料股份有限公司
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