Non-cyanogen type electrolytic gold plating bath for bump forming

A technology of electrolytic gold and electroplating solution, which is applied in the direction of circuits, printed circuits, electrical components, etc., and can solve the problems that conductive particles cannot be thermocompressed, conductive particles cannot be bonded, and poor bonding, etc.

Active Publication Date: 2009-02-11
EEJA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, conductive particles cannot be bonded by thermocompression between the gold bump and the other substrate, etc., and the connection cannot be maintained
[0012] On the other hand, when the hardness of the protrusion is too high, the conductive particles cannot be bonded due to crushing, which will cause electronic defects due to disconnection and poor bonding.

Method used

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  • Non-cyanogen type electrolytic gold plating bath for bump forming
  • Non-cyanogen type electrolytic gold plating bath for bump forming
  • Non-cyanogen type electrolytic gold plating bath for bump forming

Examples

Experimental program
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Effect test

Embodiment

[0079] According to the combination shown in Tables 1 to 5, prepare non-cyanide electrolytic gold plating solution. The unit of the compounding concentration of each raw material is g / L unless otherwise specified. However, Na3Au(SO3)2 and gold ammonium sulfite are concentrations indicating the amount of Au.

[0080] As the object to be plated, a silicon wafer having protrusion openings patterned with a phenolic positive photoresist film (substrate cross-sectional composition: gold sputtered film / TiW / SiO2) was used. The object to be plated was dipped in 1 L of the prepared non-cyanide electrolytic gold plating solution, and energized to form a gold plating film having a film thickness of 15 μm. In addition, the current efficiency of non-cyanide electrolytic gold plating solutions is usually 100% under constant plating operating conditions.

[0081] After forming a film with a predetermined film thickness, remove the mask material, the shape of the formed protrusions, the stab...

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Abstract

The invention discloses non-cyanogens-like electrolysis golden electroplate liquid used for forming protrusion, in which comprises 5 g / L to 150 g / L of conductive salt consisting of sulfurous acid gold alkali salt or sulfurous acid gold ammonium as the gold source, a crystal regulator, and potassium sulfite, 1 mg / L to 6 g / L of polyalkylene glycol with molecular weight 200 to 6000 and / or 0.1 mg to 1 g / L of ampholytic active agent, water-soluble amine and / or buffering agent; after electroplate gold plating on a patterned wafer by used of the gold electroplate liquid of the invention, protrusion with film hardness at 50 Hv to 90 Hv, and surface height difference less than 1.8 microns is formed after heat treatment at 200 degrees centigrade to 400 degrees centigrade for 5 min.

Description

technical field [0001] The present invention relates to a non-cyanide electrolytic gold plating solution for forming bumps on semiconductor wafers. More specifically, it relates to a non-cyanide electrolytic gold plating solution for forming protrusions having a flat surface and predetermined hardness. The formed protrusions are suitable for circuit bonding with an anisotropic conductive adhesive. Background technique [0002] For the non-cyanide electrolytic gold electroplating solution, the gold salt generally contains gold sulfite alkali salt or gold ammonium sulfite. It is known that the basic electroplating solution is composed of these gold salts, water-soluble amine as a gold complex stabilizer, and a trace amount of Tl, Pb or As compound as a crystallization regulator of the electroplating film, and sodium sulfite or sulfuric acid as an electrolyte. Sodium, and a buffering agent (Japanese Patent Application No. 2005-286147 (claim), Japanese Patent Application No. 2...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/48H05K3/18H01L21/288H01L21/445
CPCH01L2224/16H01L2924/07811H01L2924/01057H01L2924/01019H01L2924/01078H01L2924/01079H01L2924/00C25D3/00
Inventor 中村裕树井上晃一郎
Owner EEJA LTD
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