Ultraviolet ray/anaerobic dual curing binding agent and preparation method thereof

Abstract

The invention discloses an ultraviolet / anaerobic double-curing adhesive which comprises components with the following parts by weight: altogether 100 portions of monomer or oligomer comprising vinyl or a mixture of both, 0.01 portion to 0.5 portion of inhibitor, 0.1 portion to 10 portions of photo-initiator and an appropriate portion of anaerobic-adhesive initiator; the anaerobic-adhesive initiator comprises components with the following weight portions: 0.05 portion to 5 portions of organic hydrazide, 0.05 portion to 5 portions of tertiary amine, 0.01 portion to 2 portions of ascorbic acid, 0 portion to 1 portion of ascorbate, 0.1 portion to 5 portions of saccharin, 0 portion to 1 portion of saccharin salt, 0.5 portion to 5 portions of organic salt and 0.5 portion to 10 portions of organic peroxide. The invention also provides a preparation method of the adhesive, which comprises the steps as follows: the other components, except the organic peroxide and the photo-initiator, are mutually blended for dissolution by the conventional method; then the photo-initiator is added and dissolved; and the organic peroxide is added and mixed evenly at the temperature below 40 DEG C, and finally the adhesive is prepared. The adhesive has not only highly efficient anaerobic curing performance, but also excellent adhesive performance as an ultraviolet curing adhesive, with wide application prospect.

Description

technical field

[0001] The invention relates to an adhesive which can be cured by ultraviolet radiation and anaerobic curing and its preparation method. Background technique

[0002] Ultraviolet curing adhesive is a kind of adhesive with the characteristics of rapid curing, no VOC, green environmental protection, strong adhesion, no thermal effect during curing, and wide application range. UV-curable adhesives can be cured quickly under ultraviolet radiation, but for opaque substrates and parts in the corners of the gap, the energy received by the radiation is insufficient, and the adhesive cannot be fully cured and cannot form an effective bond. The prior art solution to this problem is to add a thermal curing component to the adhesive composition, so that the part of the adhesive that is not exposed to UV radiation can be cured by heat, however, this method requires an additional oven Such equipment is cumbersome to operate, and cannot be used for heat-sensitive materials...

Examples

Embodiment 1

[0034] 40 parts of triethylene glycol dimethacrylate, 60 parts of epoxy acrylate oligomer, 0.05 parts of hydroquinone, 0.5 parts of acetophenhydrazine, 0.5 parts of tri-n-butylamine, 0.1 parts of ascorbic acid, o-sulfonyl Mix and stir 1 part of benzimide until dissolved, then add 3 parts of photoinitiator α,α-dimethyl-α-hydroxyacetophenone, and finally add 2 parts of cumene hydroperoxide at a temperature lower than 40°C , after mixing evenly, divide into black low-density polyethylene bottles, up to 2 / 3 bottles.

[0035] Embodiment 2~9, according to the formula quantity sampling preparation shown in table 1, preparation method is the same as embodiment 1.

[0036] The adhesive prescription of table 1 embodiment 2~9

[0037] Example 2 3 4 5 6 7 8 9 epoxy acrylate 60 60 -- 60 -- -- 60 -- urethane acrylate -- -- 60 -- 60 60 -- 60 Hydroxyethyl methacrylate 40 -- 40 -- -- 20 20 --

[0038] 2-phenoxyethyl acryla...

technical field

[0001] The invention relates to an adhesive which can be cured by ultraviolet radiation and anaerobic curing and its preparation method. Background technique

[0002] Ultraviolet curing adhesive is a kind of adhesive with the characteristics of rapid curing, no VOC, green environmental protection, strong adhesion, no thermal effect during curing, and wide application range. UV-curable adhesives can be cured quickly under ultraviolet radiation, but for opaque substrates and parts in the corners of the gap, the energy received by the radiation is insufficient, and the adhesive cannot be fully cured and cannot form an effective bond. The prior art solution to this problem is to add a thermal curing component to the adhesive composition, so that the part of the adhesive that is not exposed to UV radiation can be cured by heat, however, this method requires an additional oven Such equipment is cumbersome to operate, and cannot be used for heat-sensitive materials...

Examples

Embodiment 1

[0034] 40 parts of triethylene glycol dimethacrylate, 60 parts of epoxy acrylate oligomer, 0.05 parts of hydroquinone, 0.5 parts of acetophenhydrazine, 0.5 parts of tri-n-butylamine, 0.1 parts of ascorbic acid, o-sulfonyl Mix and stir 1 part of benzimide until dissolved, then add 3 parts of photoinitiator α,α-dimethyl-α-hydroxyacetophenone, and finally add 2 parts of cumene hydroperoxide at a temperature lower than 40°C , after mixing evenly, divide into black low-density polyethylene bottles, up to 2 / 3 bottles.

[0035] Embodiment 2~9, according to the formula quantity sampling preparation shown in table 1, preparation method is the same as embodiment 1.

[0036] The adhesive prescription of table 1 embodiment 2~9

[0037] Example 2 3 4 5 6 7 8 9 epoxy acrylate 60 60 -- 60 -- -- 60 -- urethane acrylate -- -- 60 -- 60 60 -- 60 Hydroxyethyl methacrylate 40 -- 40 -- -- 20 20 --

[0038] 2-phenoxyethyl acryla...

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