Ultraviolet ray/anaerobic dual curing binding agent and preparation method thereof

A dual-curing, adhesive technology, applied in the direction of non-polymer organic compound adhesives, adhesives, etc., can solve the problems of slow anaerobic curing rate, poor surface dryness of adhesives, affecting strength, etc. Broad application prospects, high-efficiency anaerobic curing performance, and excellent comprehensive performance

Inactive Publication Date: 2009-03-25
GUANGDONG HENGDA NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the complexity of anaerobic adhesive components, the components of UV-curable adhesives and anaerobic adhesives often interact with each other. For example, some components of UV-curable adhesives, such as adhesion promoters and photoinitiators, will slow down the anaerobic curing rate. However, some components of anaerobic adhesives will make the surface dryness of the adhesive worse or affect the strength after curing.

Method used

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  • Ultraviolet ray/anaerobic dual curing binding agent and preparation method thereof
  • Ultraviolet ray/anaerobic dual curing binding agent and preparation method thereof
  • Ultraviolet ray/anaerobic dual curing binding agent and preparation method thereof

Examples

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Embodiment 1

[0034] 40 parts of triethylene glycol dimethacrylate, 60 parts of epoxy acrylate oligomer, 0.05 parts of hydroquinone, 0.5 parts of acetophenhydrazine, 0.5 parts of tri-n-butylamine, 0.1 parts of ascorbic acid, o-sulfonyl Mix and stir 1 part of benzimide until dissolved, then add 3 parts of photoinitiator α,α-dimethyl-α-hydroxyacetophenone, and finally add 2 parts of cumene hydroperoxide at a temperature lower than 40°C , after mixing evenly, divide into black low-density polyethylene bottles, up to 2 / 3 bottles.

[0035] Embodiment 2~9, according to the formula quantity sampling preparation shown in table 1, preparation method is the same as embodiment 1.

[0036] The adhesive prescription of table 1 embodiment 2~9

[0037] Example 2 3 4 5 6 7 8 9 epoxy acrylate 60 60 -- 60 -- -- 60 -- urethane acrylate -- -- 60 -- 60 60 -- 60 Hydroxyethyl methacrylate 40 -- 40 -- -- 20 20 --

[0038] 2-phenoxyethyl acryla...

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PUM

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Abstract

The invention discloses an ultraviolet/anaerobic double-curing adhesive which comprises components with the following parts by weight: altogether 100 portions of monomer or oligomer comprising vinyl or a mixture of both, 0.01 portion to 0.5 portion of inhibitor, 0.1 portion to 10 portions of photo-initiator and an appropriate portion of anaerobic-adhesive initiator; the anaerobic-adhesive initiator comprises components with the following weight portions: 0.05 portion to 5 portions of organic hydrazide, 0.05 portion to 5 portions of tertiary amine, 0.01 portion to 2 portions of ascorbic acid, 0 portion to 1 portion of ascorbate, 0.1 portion to 5 portions of saccharin, 0 portion to 1 portion of saccharin salt, 0.5 portion to 5 portions of organic salt and 0.5 portion to 10 portions of organic peroxide. The invention also provides a preparation method of the adhesive, which comprises the steps as follows: the other components, except the organic peroxide and the photo-initiator, are mutually blended for dissolution by the conventional method; then the photo-initiator is added and dissolved; and the organic peroxide is added and mixed evenly at the temperature below 40 DEG C, and finally the adhesive is prepared. The adhesive has not only highly efficient anaerobic curing performance, but also excellent adhesive performance as an ultraviolet curing adhesive, with wide application prospect.

Description

technical field [0001] The invention relates to an adhesive which can be cured by ultraviolet radiation and anaerobic curing and its preparation method. Background technique [0002] Ultraviolet curing adhesive is a kind of adhesive with the characteristics of rapid curing, no VOC, green environmental protection, strong adhesion, no thermal effect during curing, and wide application range. UV-curable adhesives can be cured quickly under ultraviolet radiation, but for opaque substrates and parts in the corners of the gap, the energy received by the radiation is insufficient, and the adhesive cannot be fully cured and cannot form an effective bond. The prior art solution to this problem is to add a thermal curing component to the adhesive composition, so that the part of the adhesive that is not exposed to UV radiation can be cured by heat, however, this method requires an additional oven Such equipment is cumbersome to operate, and cannot be used for heat-sensitive materials...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02
Inventor 刘运洪周为民
Owner GUANGDONG HENGDA NEW MATERIALS TECH
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