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Method for recycling epoxy resins and glass fibre from non-metal powder of waste printed circuit board

A technology for recycling epoxy resin and printed circuit boards, which is applied in plastic recycling, chemical recycling, recycling technology, etc., can solve the problems of limited amount of addition, pollution of resources, occupation of land resources, etc., and achieve full utilization of resources and high recovery rate high effect

Inactive Publication Date: 2009-04-15
SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention discloses a method for recovering epoxy resin and glass fiber from non-metallic powder of waste printed circuit board (PCB) under mild conditions. Incineration not only occupies valuable land resources, but also seriously wastes resources and pollutes the environment; using non-metallic powder as filler to prepare building materials or other materials, the amount of addition is limited and will affect the performance of the material; recycling by pyrolysis, due to the heat of pyrolysis products The value is low and will become tertiary waste; other methods such as ultrasonic method require special equipment and higher cost and other issues

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Add 150mL of water to a 250mL flask containing 30g of waste PCB non-metallic powder, stir for 4 to 5 minutes, pour off the water layer, and then wash with the same amount of water until the water layer is clear. Then add 150mL of 0.8mol / L sulfuric acid, heat at 55°C for 4 hours, add the solid obtained by filtration directly into a 250mL flask, then add 300mL of 5mol / L nitric acid, heat at 95°C for 35 hours, filter, and recycle the filtrate for reuse. After the solid was washed with water until neutral, it was poured into a 250mL round bottom flask, 150mL of ethyl acetate was added, stirred, filtered, washed with the same organic solvent until it was colorless, and glass fibers were obtained. The filtrate was evaporated to dryness to obtain a solid epoxy resin.

[0025] Add the solid epoxy resin obtained above into a 250mL round bottom flask, add 180mL of 4mol / L nitric acid / sulfuric acid, heat to 85°C under stirring, and react for 20 hours. After the reaction is complete...

Embodiment 2

[0028] Add 150mL of water to a 250mL flask containing 30g of waste PCB non-metallic powder, stir for 4 to 5 minutes, pour off the water layer, and then wash with the same amount of water until the water layer is clear. Then add 300mL of 4mol / L sulfuric acid, heat at 35°C for 0.5 hours, filter the solid obtained directly into a 250mL flask, then add 90mL of 8mol / L nitric acid, heat at 75°C for 8 hours and then filter, the filtrate is recycled for reuse. After the solid was washed with water until neutral, it was poured into a 250mL round bottom flask, 100mL of ethyl acetate was added, stirred, filtered, washed with the same organic solvent until colorless, and glass fibers were obtained. The filtrate was evaporated to dryness to obtain a solid epoxy resin.

[0029] Add the solid epoxy resin obtained above into a 250mL round bottom flask, add 90mL of 7mol / L nitric acid / sulfuric acid, heat to 55°C under stirring, and react for 20 hours. After the reaction is completed, extract th...

Embodiment 3

[0032] Add 150mL of water to a 250mL flask containing 30g of waste PCB non-metallic powder, stir for 4 to 5 minutes, pour off the water layer, and then wash with the same amount of water until the water layer is clear. Then add 150mL of 1 mol / L nitric acid, heat at 40°C for 1.5 hours, add the solid obtained by filtration directly into a 250mL flask, then add 100mL of 6mol / L nitric acid, heat at 85°C for 20 hours, then filter, and recycle the filtrate for reuse. After the solid was washed with water until neutral, it was poured into a 250mL round bottom flask, 100mL of ethyl acetate was added, stirred, filtered, washed with the same organic solvent until colorless, and glass fibers were obtained. The filtrate was evaporated to dryness to obtain a solid epoxy resin.

[0033]Add the solid epoxy resin obtained above into a 250mL round bottom flask, add 100mL of 5mol / L nitric acid / sulfuric acid, heat to 80°C under stirring, and react for 10 hours. After the reaction is completed, e...

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Abstract

The invention discloses a method for recycling epoxide resin and glass fiber from non-metal powder in waste printed circuit boards, comprising the following steps of: (1) pretreatment, and dust removal by washing; (2) removing residue metal: inorganic acid is used for removing the residue metal in the non-metal powder, and the obtained powder can be used directly after being filtrated; (3) preliminary decomposition: the processed non-metal powder is added into inorganic acid, the obtained mixture is heated for reaction and then filtrated; the filtrated solid is added into organic solvent, stirred and filtrated and the obtained solid is the glass fiber; and the organic solvent in the filtrate is evaporated so as to obtain the solid epoxide resin; and (4) secondary decomposition: the obtained solid epoxide resin is added into inorganic acid, and heated for reaction; and then the organic solvent is used for extraction and then is evaporated so as to obtain low molecular weight epoxide resin. The invention realizes green recycling of the non-metal powder of the waste printed circuit boards under the moderate condition and has high recovery rate, thus not only being capable of reducing the emission of pollutants but also leading the resource to be fully utilized.

Description

technical field [0001] The invention relates to a method for recovering epoxy resin and glass fiber from non-metallic powder of waste printed circuit boards. Background technique [0002] Printed Circuit Boards (PCB for short) is an essential part of electronic products, ranging from electronic watches, calculators, general-purpose computers, to computers, communication equipment, military weapon systems, as long as there are integrated circuits And other electronic components, there are printed circuit boards. The proportion of printed circuit boards in electronic products is relatively high, such as in computers, the content rate can reach 20-30% (mass ratio). [0003] Discarded PCBs mainly come from two aspects: one is from various scrapped electrical products. At present, my country's household appliances have entered the peak period of elimination and scrapping. How to deal with these printed circuit boards in waste electrical appliances has become a problem for some g...

Claims

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Application Information

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IPC IPC(8): C08J11/16C08L63/00B09B3/00
CPCC08J11/16C08J2363/00Y02P20/582Y02W30/62
Inventor 管传金王景伟周玉林
Owner SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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