Method for recycling epoxy resins and glass fibre from non-metal powder of waste printed circuit board

A technology for recycling epoxy resin and printed circuit boards, which is applied in plastic recycling, chemical recycling, recycling technology, etc., can solve the problems of limited amount of addition, pollution of resources, occupation of land resources, etc., and achieve full utilization of resources and high recovery rate high effect

Inactive Publication Date: 2009-04-15
SHANGHAI SECOND POLYTECHNIC UNIVERSITY
View PDF0 Cites 28 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention discloses a method for recovering epoxy resin and glass fiber from non-metallic powder of waste printed circuit board (PCB) under mild conditions. Incineration not only occupies valuable land resources, but also seriously wastes resources and pollutes the environment; using non-metallic powder as filler to p

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0023] Example 1

[0024] Add 150 mL of water to a 250 mL flask containing 30 g of waste PCB non-metal powder, stir for 4 to 5 minutes, pour off the water layer, and then wash with the same amount of water until the water layer is clear. Then add 150mL of 0.8mol / L sulfuric acid and heat at 55°C for 4 hours. The filtered solid is directly added to a 250mL flask, and then 300mL of 5mol / L nitric acid is added. After heating at 95°C for 35 hours, it is filtered and the filtrate is recovered and reused. After the solid was washed with water to neutrality, it was poured into a 250 mL round bottom flask, 150 mL of ethyl acetate was added, stirred, filtered, and washed with the same organic solvent until it was colorless to obtain glass fiber. The filtrate was evaporated to dryness to obtain a solid epoxy resin.

[0025] Add the solid epoxy resin obtained above into a 250mL round bottom flask, add 180mL of 4mol / L nitric acid / sulfuric acid, heat to 85°C with stirring, and react for 20 hour...

Example Embodiment

[0027] Example 2

[0028] Add 150 mL of water to a 250 mL flask containing 30 g of waste PCB non-metal powder, stir for 4 to 5 minutes, pour off the water layer, and then wash with the same amount of water until the water layer is clear. Then add 300mL of 4mol / L sulfuric acid, heat at 35°C for 0.5 hours, directly add the filtered solid into a 250mL flask, add 90mL of 8mol / L nitric acid, heat at 75°C for 8 hours, filter, and recover the filtrate for reuse. After the solid was washed with water to neutrality, it was poured into a 250 mL round bottom flask, 100 mL ethyl acetate was added, stirred, filtered, and washed with the same organic solvent until it was colorless to obtain glass fiber. The filtrate was evaporated to dryness to obtain a solid epoxy resin.

[0029] Add the solid epoxy resin obtained above into a 250mL round bottom flask, add 7mol / L nitric acid / sulfuric acid 90mL, heat to 55°C with stirring, and react for 20 hours. After the reaction is completed, the water layer...

Example Embodiment

[0031] Example 3

[0032] Add 150 mL of water to a 250 mL flask containing 30 g of waste PCB non-metal powder, stir for 4 to 5 minutes, pour off the water layer, and then wash with the same amount of water until the water layer is clear. Then add 150mL of 1mol / L nitric acid, heat at 40°C for 1.5 hours, directly add the filtered solid into a 250mL flask, add 100mL of 6mol / L nitric acid, heat at 85°C for 20 hours, filter, and recover the filtrate for reuse. After the solid was washed with water to neutrality, it was poured into a 250 mL round bottom flask, 100 mL ethyl acetate was added, stirred, filtered, and washed with the same organic solvent until it was colorless to obtain glass fiber. The filtrate was evaporated to dryness to obtain a solid epoxy resin.

[0033]Add the solid epoxy resin obtained above into a 250mL round bottom flask, add 5mol / L nitric acid / sulfuric acid 100mL, heat to 80°C with stirring, and react for 10 hours. After the reaction is completed, the water layer...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for recycling epoxide resin and glass fiber from non-metal powder in waste printed circuit boards, comprising the following steps of: (1) pretreatment, and dust removal by washing; (2) removing residue metal: inorganic acid is used for removing the residue metal in the non-metal powder, and the obtained powder can be used directly after being filtrated; (3) preliminary decomposition: the processed non-metal powder is added into inorganic acid, the obtained mixture is heated for reaction and then filtrated; the filtrated solid is added into organic solvent, stirred and filtrated and the obtained solid is the glass fiber; and the organic solvent in the filtrate is evaporated so as to obtain the solid epoxide resin; and (4) secondary decomposition: the obtained solid epoxide resin is added into inorganic acid, and heated for reaction; and then the organic solvent is used for extraction and then is evaporated so as to obtain low molecular weight epoxide resin. The invention realizes green recycling of the non-metal powder of the waste printed circuit boards under the moderate condition and has high recovery rate, thus not only being capable of reducing the emission of pollutants but also leading the resource to be fully utilized.

Description

technical field [0001] The invention relates to a method for recovering epoxy resin and glass fiber from non-metallic powder of waste printed circuit boards. Background technique [0002] Printed Circuit Boards (PCB for short) is an essential part of electronic products, ranging from electronic watches, calculators, general-purpose computers, to computers, communication equipment, military weapon systems, as long as there are integrated circuits And other electronic components, there are printed circuit boards. The proportion of printed circuit boards in electronic products is relatively high, such as in computers, the content rate can reach 20-30% (mass ratio). [0003] Discarded PCBs mainly come from two aspects: one is from various scrapped electrical products. At present, my country's household appliances have entered the peak period of elimination and scrapping. How to deal with these printed circuit boards in waste electrical appliances has become a problem for some g...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C08J11/16C08L63/00B09B3/00
CPCC08J11/16C08J2363/00Y02P20/582Y02W30/62
Inventor 管传金王景伟周玉林
Owner SHANGHAI SECOND POLYTECHNIC UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap