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Borane catalyst complexes with amide functional polymers and curable compositions made therefrom

一种酰胺官能、络合物的技术,应用在有机化合物/氢化物/配位配合物催化剂、物理/化学过程催化剂、非高分子有机化合物粘合剂等方向,能够解决加工时间高成本等问题

Inactive Publication Date: 2009-06-03
DOW CORNING CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, the temperatures required to cure addition-curable silicone compositions exceed the thermal stability limits of some polymeric substrates and / or components mounted thereon
While other examples of external treatments of component surfaces exist, such as the application of primers or exposure to high energy sources such as plasma, corona or UV light, even these treatments require additional processing time or high costs in the fabrication process device, or both

Method used

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  • Borane catalyst complexes with amide functional polymers and curable compositions made therefrom
  • Borane catalyst complexes with amide functional polymers and curable compositions made therefrom
  • Borane catalyst complexes with amide functional polymers and curable compositions made therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

Example 1 - Preparation of oxyalkylene-amides

[0101] Into a 500 ml round bottom flask equipped with a thermometer, electric stirrer, nitrogen purge and condenser were introduced 72.02 g of triethylene glycol diamine (XTJ-504 Huntsman, Houston, Texa s) and 184.79 g of undecylenic acid (Atofina, France). With stirring stopped, the mixture in the flask was purged with nitrogen for 5 minutes to remove any oxygen in the headspace. The mixer was then turned on, and the mixture quickly turned light yellow once the two reactants reacted. The resulting mixture was then heated to 120°C and maintained at this temperature for 1 hour. Next, the reaction was allowed to continue at this temperature for 1 hour. The material was then heated at 220°C for 2 hours and further heated to 240°C and held under vacuum and nitrogen purge for 2 hours to strip out impurities.

[0102] The resulting reaction mixture was cooled to 150°C, poured into an aluminum lined saucepan, and allowed to cool ...

Embodiment 2

Example 2 - Preparation of Si-oxyalkylene amides

[0103] Introduce 50 g of the polyether-amide of Example 1 and 50 g of toluene into a 1000 ml three-necked round bottom flask equipped with a temperature probe, electric stirrer and condenser, and heat at 115° C. for 15 minutes to dissolve the polyether-amide . Then, 154 g of a dimethylhydrogen-terminated polydimethylsiloxane having the following average formula were added dropwise by means of a dropping funnel:

After adding the first 5 g of siloxane, 0.28 g of platinum catalyst (1,3-divinyl-1,1,3,3-tetramethyldisiloxane platinum complexed in dimethylsiloxane ) were added to the mixture. When the addition of siloxane was complete, a further 0.2 g of catalyst was added and mixed for an additional hour. The reaction mixture was then heated to 120°C and vacuum was applied slowly to reduce the pressure to below 10 mmHg in order to remove the solvent. The resulting polymer had a Mw of 58300 and a polydispersity of 3.75. ...

reference example 3-

Reference example 3-General procedures for synthesizing complexes

[0104] By using BH in an oxygen-free environment 3 - THF (tetrahydrofuran) hydroboration of allylsilane- or vinylsilane-containing monomers / polymers to synthesize organosilicon-functional borane-amine catalyst complexes with amide-functional polymers. With the aid of a syringe and needle, introduce BH into a three-necked round bottom flask equipped with a magnetic stir bar, thermometer, condenser, and rubber septum 3 - THF solution. Keep the mixture at 0°C. The appropriate silane was then added and the mixture was stirred at room temperature for 3 hours. Treatment of the resulting hydroboration product with an appropriate amide copolymer forms an air-stable organosilicon-functional borane-amide copolymer catalyst complex.

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Abstract

Borane catalyst complexes with amide functional polymers have a borane portion of the complex that may contain at least one silicon atom. The catalyst complexes can be used as components in curable compositions containing (i) the catalyst complex, (ii) a free radical polymerizable monomer, oligomer or polymer, and optionally (iii) a decomplexer. The curable compositions may contain a component capable of generating a gas, as well as various other optional ingredients. These curable compositions can be used as rubbers, tapes, adhesives, protective coatings, thin films, thermoplastic monolithic molded parts, thermosetting monolithic molded parts, sealants, foams, gaskets, seals, o-rings, pressure sensitive adhesives, die attachment adhesives, lid sealants, encapsulants, potting compounds, conformal coatings, and electronic components. The compositions can also be used in composite articles of manufacture in which substrates are coated or bonded together with the composition and cured, such as in connectors, diving masks, or other integrally bonded parts.

Description

[0001] Cross References to Related Applications [0001] This application claims the benefit of US Provisional Application Serial No. 60 / 802749, filed May 23, 2006. US Provisional Application Serial No. 60 / 802749 is hereby incorporated by reference. technical field [0002] Borane catalyst complexes ("catalyst complexes") of amide-functional polymers are suitable as initiators for curing various curable compositions. Curing is defined herein as a chemical reaction, such as polymerization or crosslinking, that results in an increase in the average molecular weight of the polymerizable compound so that the composition thickens or hardens. [0003] Curable compositions comprising catalyst complexes and composite articles comprising the curable compositions and at least one substrate are disclosed. Curable compositions offer the advantage of being able to cure at low temperatures. [0004] The method of making a composite article in which the curable composition is in the form ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J31/14B01J33/00C08F4/52C08F220/18C08G77/00C08K5/55C08L77/00C08L83/04C08L83/10C09J4/00
CPCC08F4/52C08L83/04C08L83/10C08K5/55B01J31/146Y10T428/28Y10T428/24479Y10T428/31663C08L83/00C08F220/18C08G77/00
Inventor M·默哈迈德
Owner DOW CORNING CORP