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Silicone resin composition

A resin composition, silicone technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of difficult to obtain transparent resin, opaque, difficult to disperse metal oxide particles, and achieve good light extraction efficiency and high transparency. The effect of stability, stability and dispersion

Inactive Publication Date: 2013-11-06
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, there are problems that since silicone resin is extremely hydrophobic, it is difficult to disperse metal oxide fine particles in a non-agglomerated state, and it is difficult to obtain a transparent resin because it eventually becomes opaque

Method used

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  • Silicone resin composition
  • Silicone resin composition
  • Silicone resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] In a container equipped with a stirrer, a reflux condenser, and a nitrogen gas introduction tube, a methanol dispersion of anatase-type titanium oxide particles with an average particle diameter of 15 nm (trade name: ELCOMNT-1089TIV, manufactured by Catalyst Chemical Industry Co., Ltd., solid content concentration 30.4% by weight) 3.0 g, 0.7 g of water, 1.8 g (15 mmol) of dimethyldimethoxysilane (KBM22, manufactured by Shin-Etsu Silicone Co., Ltd.) as a difunctional alkoxysilane, and 1.8 g (15 mmol) as a trifunctional 2-((3,4)-epoxycyclohexyl) ethyltrimethoxysilane (KBM303, manufactured by Shin-Etsu Silicone Co., Ltd.) of oxysilane 1.5 g (6 mmol) [2-functionality alkoxysilane / 3 Functional alkoxysilane (molar ratio) = 15 / 6], heated and stirred at 60° C. for 6 hours to react. Then, it cooled to room temperature, and obtained the resin composition for optical-semiconductor element sealing, after distilling off a solvent.

[0051] Separately, this resin composition was dis...

Embodiment 2

[0054] In addition to using 1.5 g (6 mmol) of 3-methacryloxypropyltrimethoxysilane (KBM503, manufactured by Shin-Etsu Silicone Co., Ltd.) as a trifunctional alkoxysilane [2 functional alkoxysilane / 3 functional Degree alkoxysilane (molar ratio) = 15 / 6], others were similar to Example 1 to obtain a resin composition for optical semiconductor element sealing.

[0055] In addition, the transmittance of the film produced in the same manner as in Example 1 was 99.8%, the haze was 0.7%, and the refractive index was 1.522. Furthermore, in the same manner as in Example 1, the blue light-emitting diode was sealed to obtain a blue light-emitting diode device.

Embodiment 3

[0057] Except that 1.7 g (7 mmol) of 3-glycidoxypropyltrimethoxysilane (KBM403, manufactured by Shin-Etsu Silicone Co., Ltd.) [2-functionality alkoxysilane / 3-functionality The resin composition for optical-semiconductor element sealing was obtained similarly to Example 1 except alkoxysilane (molar ratio)=15 / 7].

[0058] In addition, the transmittance of the film produced in the same manner as in Example 1 was 99.8%, the haze was 0.2%, and the refractive index was 1.508. Furthermore, in the same manner as in Example 1, the blue light-emitting diode was sealed to obtain a blue light-emitting diode device.

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Abstract

The invention provides an organic siliconresin composition which is characterized in that the metal oxide particles can be dispersed steadily, has high index of refraction and high pellucidity, a production method of the organic siliconresin composition and a semiconductor device obtained by using the organic siliconresin composition for sealing a photo-semiconductor component. The organic siliconresin composition is obtained from the reaction between a 2-functionality alkoxy silane and a 3-functionality alkoxy silane in the existence of a dispersion liquid of the metal oxide particles; wherein, the 2-functionality alkoxy silane and the 3-functionality alkoxy silane are reacted to the surfaces of metal oxide particles respectively, thus forming the macromolecule quantized resin simultaneously.

Description

technical field [0001] The present invention relates to a silicone resin composition, a method for producing the composition, and an optical semiconductor device obtained by using the composition. Background technique [0002] As resin for optical-semiconductor element sealing, the silicone resin favorable in heat resistance can be used (for example, patent document 1, patent document 2). [0003] On the other hand, in order to improve the light extraction efficiency, it is desired to increase the refractive index of the resin. As means for increasing the refractive index of the resin, a method of dispersing metal oxide fine particles having a high refractive index is considered. [0004] However, there are problems in that since silicone resin is extremely hydrophobic, it is difficult to disperse metal oxide fine particles in a non-aggregated state, and it is difficult to obtain a transparent resin because it eventually becomes opaque. [0005] Patent Document 1: Japanese...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04C08K3/22C08G77/06H01L33/00
Inventor 平野敬祐
Owner NITTO DENKO CORP