Non-contact type embedded body of electronic credential and method for producing the same

A non-contact, electronic certificate technology, applied to record carriers, computer parts, printing, etc. used by machines, can solve the problems of unsuitable certificate cover, lack of extensiveness, single material selection, etc., and achieve simple manufacturing methods, The effect of strong firmness and reduction of manufacturing cost

Inactive Publication Date: 2009-07-08
SHANGHAI MITE SPECIALITY & PRECISION PRINTING
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the non-contact embedded body that is commonly used in card-type documents is not suitable for placing on the cover of the document because the material used is relatively stiff.
[0004] However, most countries now use specific materials as the constituent materials of the non-co

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Non-contact type embedded body of electronic credential and method for producing the same
  • Non-contact type embedded body of electronic credential and method for producing the same
  • Non-contact type embedded body of electronic credential and method for producing the same

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0035] Example one

[0036] Reference figure 1 In the structure shown, materials for the upper protective layer 1, the upper connecting layer 2, the chip carrier layer 3, the lower connecting layer 4, and the lower protective layer 5 are prepared. The upper protective layer 1 and the lower protective layer 5 are made of soft materials suitable for the binding process of the document and the traditional pasting adhesive. The die-cutting of the chip hole is performed on the chip carrier layer 3, and then the non-contact coil and the chip 6 are embedded on the chip carrier layer 3. In this example, the thickness of the chip carrier layer 3 is preferably 0.15-0.25 mm, the thickness of the upper connection layer 2 and the lower connection layer 4 are 0.04-0.06 mm, and the thickness of the upper protective layer and the lower protective layer are both 0.12-0.15 mm. After all the materials are prepared, follow the figure 1 After the stacking is completed, perform lamination under high ...

Example Embodiment

[0037] Example two

[0038] Such as figure 2 As shown, the upper protective layer 1 and the upper connecting layer 2, the lower connecting layer 4 and the lower protective layer 5 are pre-composited to obtain the upper composite fabric 12 and the lower composite fabric 45 with a thickness of 0.1 mm to 0.2 mm. The compounding method can use high-temperature thermal compounding method, direct compounding method by casting method, or adhesive bonding method. After bonding, perform high-temperature and high-pressure operation as described in Example 1, and finally make it as figure 2 The finished non-contact insert shown.

Example Embodiment

[0039] Example three

[0040] Such as image 3 As shown, when the non-contact embedded body is produced, the structure of the non-contact embedded body is adjusted according to the structure of the chip. For example, the chip carrier layer 3 is adjusted to a two-layer structure of a first layer structure 31 and a second layer structure 32 to Adapt to the thickness of the chip. For example, the thickness of the first layer structure 31 is 0.1mm, and the thickness of the second layer structure 32 is 0.15mm. Then follow the operation of Example 1, and finally make it as image 3 The finished product of the non-contact insert shown.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to view more

Abstract

The invention provides a non-contact embedded body of an electronic certificate and a method for manufacturing the same. The embedded body comprises an upper protective layer, an upper connecting layer, a chip bearing bed, a lower connecting layer and a lower protective layer which are molten and compounded from top to bottom in sequence. The materials of the upper protective layer and the lower protective layer are a flexible material suitable for combining the certificate binding process and the prior paperhanging adhesive. The materials of the upper protective layer and the lower protective layer are fiber materials with a textile structure, or non-woven fabric, or paper or cotton fabric. The materials of the connecting layers are macromolecular and thermoplastic elastic films. The invention also provides the method for manufacturing the non-contact embedded body of the electronic certificate. The method comprise: melting and compounding the upper protective layer, the upper connecting layer, the chip bearing bed, the lower connecting layer and the lower protective layer from top to bottom to obtain the product. The embedded body has the advantages of strong fastness, warp resistance and flexure resistance. The material choosing range is widened through a reasonable layer structure, and the manufacturing method is simple and greatly reduces the manufacture cost.

Description

technical field [0001] The present invention relates to a non-contact embedded body (INLAY) of electronic documents, in particular to a non-contact identification embedded body used in the cover of electronic identity documents such as passports, pilot cards, seaman's cards, and journalist cards, and the manufacture of such embedded bodies method. Background technique [0002] With the deepening of anti-counterfeiting technology, the requirements for identification documents are getting higher and higher. Radio frequency identification technology (RFID) may be more applied to electronic identity documents due to its technical characteristics such as high security and no exposed contacts. How to make the non-contact inlay adapt to the assembly line binding process of the document, retain the binding process and style of the original document to the greatest extent, and control the overall requirements of the document after adding the inlay to meet the standards of the Interna...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B42D15/10G06K19/07B42D25/22B42D25/455
Inventor 陆泰伟李志明薛晓蓉瞿蓉蕖曹世庆杨四九赵毅喆
Owner SHANGHAI MITE SPECIALITY & PRECISION PRINTING
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap