Powder encapsulating process of capacitor

Abstract

The invention discloses a powder encapsulating process of a capacitor, which comprises the following: a step of fluidization: putting a processed capacitor into a ventilating and dry fluidized bed with compressed air to perform heating; a step of powder encapsulation: after the capacitor is heated, performing dip coating in the fluidized bed by using a powder encapsulating material, and curing and forming the capacitor; a step of corner cut: cutting off heaves or burrs generated outside the capacitor after the dip coating by using a mechanical device or manual work; a step of levelling: putting the encapsulated capacitor into a baking box and heating the capacitor for certain period of time so that an outer encapsulated layer of the capacitor is leveled into a film; a step of photo-curing: adding a curing agent and a photo initiator to the outer encapsulated layer and irradiating the outer encapsulated layer by purple light; and a step of laser marking: using a laser marking machine to print characters with a light color developing reagent on the surface of the cured capacitor. The all electrical properties of the finished product of the capacitor manufactured by the process can reach the standard, and the process has the advantages that the processing efficiency is high, the manpower and energy sources are saved, and the production cost is reduced.

Description

technical field [0001] The invention relates to a production process of electronic components, in particular to a powder encapsulation process of a capacitor. Background technique [0002] After the core of the existing capacitor is manufactured and processed, it needs to be covered with a layer of sealing material on the outside, which not only protects the core, but also changes the electrical properties of the capacitor to a certain extent. The traditional powder encapsulation process can be roughly divided into fluidization, encapsulation, corner cutting, leveling and curing, marking, and finally packaging. The curing process adopts tunnel kiln curing. The main characteristics of tunnel kiln are uniform temperature, It saves manpower and has strong product consistency. However, due to the characteristic that the tunnel kiln needs to be heated up 150 degrees in advance and the curing time is as long as 2 hours, on the one hand, the encapsulation material needs to consume...

AI Technical Summary

Problems solved by technology

However, due to the characteristic that the tunnel kiln needs to be heated up 150 degrees in advance and the curing time is as long as 2 hours, on the one hand, the encapsulation material needs to consume a lot of electricity during the curing process, which increases the production cost of the manufacturer; on the other hand On the one hand, in the process of mass production, the curing time of each batch takes about 2 hours, and the production process takes a long time, resulting in relatively low production efficiency

During laser marking, due to the marking material used, the printed mark is black, which is not beautiful and clear enough and consumes too much energy

In the leveling process, the so-called leveling process is a process in which the product is kept in an oven at a set temperature for a specified time when the surface of the product is rough after encapsulation, because the softening point of the added epoxy resin is high, and the leveling process The high leveling temperature in the process will easily cause the product to sag, consume a lot of energy, and the product is prone to cracks, chipping and deformation

[0003] To sum up, the traditional powder encapsulation process is not only inefficient and consumes a lot of energy, but also the performance of the finished product is difficult to meet the standards, and the failure rate is high