High-purity nickel target for magnetron sputtering

Abstract

The invention relates to a high-purity nickel target for magnetron sputtering. A circular sputtering ring with a regular shape or irregular shape is arranged on the sputtering surface or the surface of the back side of a flat target, the typical shape of the sputtering ring can be a rectangular shape, a round rectangular shape, an octagonal rectangular shape, a double-hemicycle rectangular shape,a hexagonal rectangular shape or an oval shape; a groove is positioned above a magnet behind the target, the groove can be a rectangular groove, a U-shaped groove, a V-shaped groove, a groove with a rectangular upper part and a trapezoidal lower part, a dovetail groove with a wide upper part and a narrow lower part or a double-rectangular groove with a wide upper part and a narrow lower part; a groove outside the sputtering ring is of a step shape. The invention has the advantages that the high-purity nickel target overcomes the problems of magnetic shielding of the magnetron sputtering ferromagnetic target, uneven distribution of the magnetic field after erosion, uneven transversal erosion and low utilization ratio of the target, overcomes the thickness limitation of the magnetic pure-nickel target, greatly reduces the change of the pure-nickel target along with the magnetron sputtering process, improves the uniformity of the coated film, equalizes the etched depth of the sputtering ring and greatly improves the utilization ratio of the pure-nickel target.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering coating, and in particular provides a high-purity nickel target material for magnetron sputtering. Background technique [0002] The sputtering method is widely used in wear-resistant parts, solar films, magnetic heads, chips and magnetic recording media, glass surfaces, a method of forming thin films on polyester tapes, film foam and polyurethane foam, etc., with high coating density , good adhesion, rapid development in recent years, wide application. [0003] Most of the sputtering practiced today is magnetron sputtering. The principle of magnetron sputtering Electrons collide with argon atoms during the process of accelerating to the substrate under the action of an electric field, ionizing a large number of argon ions and electrons. Under the action of the electric field, the argon ions accelerate the bombardment of the target, sputtering out a large number of target atoms, and...

AI Technical Summary

Problems solved by technology

[0007] Existing problems 1. The thickness of the pure nickel target should not be too thick, which will affect the utilization of the target

[0009]The second problem is that the magnetic field distribution is uneven after the sputtering etching ring is formed on the pure nickel target, and the etching is deep and deteriorated in a V-shape, which affects the coating quality and pure nickel. Nickel target utilization

[0011]The third problem is that there is a difference in the magnetic field strength between the straight track and the corner of the pure nickel rectangular target, and the etching depth difference between the straight track and the corner of the sputtering etching ring is large , the depth of the deepest etching determines the life of the target

If the curve magnets are reduced, on the one hand, the uneven distribution of the magnetic field will cause differences in the coating quality, and at the same time, sometimes about 50% of the erosion is caused in the curves, while the erosion of more than 85% in the straight roads

From the analysis of problem 2, it can be seen that the difference in the magnetic field of the existing planar pure nickel target material in the early stage will cause the difference in the etching depth of the sputtering sputtering ring later, and the difference in the magnetic field further strengthened by the difference in depth makes the difference continue to enlarge, and finally make a big difference

This will inevitably lead to low target utilization and short life

[0013] The fourth problem is that the target material is too thick and the cooling is not good. Due to the increase in the heat of the target material, the temperature of the material substrate to be plated is high. For materials such as glass It has no effect, but it has a greater impact on organic films or various types of foam. Organic films or foams are easily deformed when heated. When the temperature exceeds a certain threshold, the foam will also volatilize some gas, which will easily cause damage to the vacuum chamber. and target pollution, seriously affecting the quality of coating products

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