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Silver paste for gluing tantalum capacitor and preparation method thereof

A technology of tantalum capacitors and silver paste, which is applied in the field of bonding silver paste for tantalum capacitors and its preparation, can solve the problems of unstable quality and low bonding strength, and achieve good anti-sinking, good bonding strength, and stable storage Effect

Active Publication Date: 2009-10-21
CNMC NINGXIA ORIENT GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conductive glue or conductive paste disclosed in the above-mentioned patent documents is mostly used in the process of conductive pattern and film printing. When used as a conductive glue for tantalum capacitors, it has the disadvantages of low bonding strength and unstable quality.

Method used

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  • Silver paste for gluing tantalum capacitor and preparation method thereof

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preparation example Construction

[0051] The preparation steps of bonding silver paste of the present invention:

[0052] 1) Fully mix epoxy resin, curing agent, accelerator, anti-settling agent, solvent and silver powder in proportion. As preferably, the present invention first mixes epoxy resin, curing agent, accelerator, anti-sedimentation agent and solvent in proportion, puts into high-speed disperser and stirs, then adds required proportion of silver powder to the above-mentioned mixture, and continues to stir.

[0053] 2) Rolling the uniformly mixed silver paste to grind the silver paste particles into a micron size and disperse them more uniformly. The rolling method is well known to those skilled in the art. The present invention preferably uses a three-roll mill for rolling.

[0054] After the silver paste is rolled, its viscosity value can be detected with a rotational viscometer. The viscosity range of the silver paste with good dot paste molding is preferably controlled at 100Pa·s-800Pa·s, more p...

Embodiment 1

[0057] The method for preparing the bonding silver paste for tantalum capacitors in this embodiment comprises steps:

[0058] 1) Take epoxy resin E-51 according to the amount of 15% in the silver paste, and the epoxy resin E-51 is a product of Shanghai Kaiping Resin Co., Ltd.;

[0059] 2) Weigh the tertiary amine curing agent DMP-30 according to the content of 6% in the silver paste, and the DMP-30 is a product of Wuxi Huili Synthetic Materials Co., Ltd.;

[0060] 3) Take tetraethylammonium bromide according to the content of 2% in the silver paste, and the tetraethylammonium bromide is a product of Wuxi Huilong Electronic Materials Co., Ltd.;

[0061] 4) Weigh fumed silica according to the content of 3% in the silver paste, and said fumed silica is a product of Guangzhou Hualisen Trading Co., Ltd.;

[0062] 5) Take by weighing the mixed solution of butyl acetate and isoamyl acetate according to the amount of 9% content in the silver paste, the ratio of the content of butyl a...

Embodiment 2

[0067] Same as the preparation method of Example 1, the percentage by weight of each component is selected as: epoxy resin E-51 of Shanghai Kaiping Resin Co., Ltd.: 12%; phthalic anhydride PA 50-65 of Jiangyin Zhongrun Chemical Co., Ltd. : 9%; 1,2-dimethylimidazole from Wuxi Huilong Electronic Materials Co., Ltd.: 1%; hydrogenated castor oil from Tongliao Weining Chemical Co., Ltd.: 1%; acetic acid from Zhejiang Jiande Jianye Organic Chemical Co., Ltd. 1:1 mixture of butyl ester and isoamyl acetate from Shanghai Maochang Chemical Co., Ltd.: 7%; 1 μm-20 μm flake silver powder: 70%.

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Abstract

The invention provides a silver paste for gluing a tantalum capacitor, which comprises the following components according to weight percentage: 60-80 percent of silver powder; 5-18 percent of epoxy resin; 4-15 percent of solidifying agent; 0.1-2 percent of accelerant; 0.5-3 percent of anti-settling agent; and 2-10 percent of solvent. The invention also provides a preparation method of the tantalum capacitor as follows: 1) the epoxy resin, the solidifying agent, the accelerant, the anti-settling agent, the dissolvent and the silver powder are mixed according to proportion; and 2) the evenly mixed silver paste is rolled. The gluing silver paste provided by the invention has good dispersiveness and anti-settling performance as well as good electric conductivity and high gluing strength. Test results show that the silver paste provided by the invention has the gluing strength of more than or equal to 3MP and good overall performance, and can meet the current requirements for highly automatic production of the tantalum capacitor.

Description

technical field [0001] The invention relates to the field of electronic materials, in particular to a bonding silver paste for tantalum capacitors and a preparation method thereof. Background technique [0002] In the production of tantalum capacitors, it is necessary to paste conductive materials on the surface of the dielectric layer to form the cathode layer. Usually, conductive glue is used to coat the conductive material on the surface of the dielectric layer to obtain an electrolyte with high conductivity. Conductive adhesive is an adhesive that can effectively bond various materials and has conductive properties. At present, the widely used conductive adhesive is filled conductive adhesive, which uses adhesive material as the matrix and relies on the addition of conductive fillers to make the glue conductive. [0003] In the prior art, various conductive pastes or pastes for electronic materials are disclosed. Chinese patent document CN 1053516C discloses a "Surface...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01G9/042H01G9/022
Inventor 吴红沈月英刘秉宁马淑珍
Owner CNMC NINGXIA ORIENT GRP
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