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Electromagnet assisted plating hot dip plating method

A hot-dip plating and electromagnetic technology, applied in the hot-dip plating process, metal material coating process, coating, etc., can solve the problems of undiscovered coating grain bonding quality, etc., achieve rapid changes in pulsed electromagnetic fields, low power consumption, The effect of easy electrode material problems

Active Publication Date: 2011-07-20
BAOSHAN IRON & STEEL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there are no patents or literature reports that can be used to control the quality of the coating grains and the substrate with electromagnetic technology.

Method used

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  • Electromagnet assisted plating hot dip plating method
  • Electromagnet assisted plating hot dip plating method
  • Electromagnet assisted plating hot dip plating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Such as figure 1 , The device as the above scheme mainly includes: electrode 3, electromagnetic coil 5, pulse power supply 6, speed sensor 11, wire 7, sinking roller 9, zinc crucible 10, etc. When working, the electrode 3 is inserted into the plating pool 8, and the pulse frequency is 0.1-100kHz. In the process of hot-dip galvanizing, the strip steel 1 exits the zinc crucible 10 from the molten zinc pool 8 after being reversed by the sinking roller 9, and a pulse electrode 3 is set in the molten pool below the liquid surface 2, with a total of 16 electrode heads. , placed in pairs and groups on both sides of the strip 1, and the electrodes are 0.05m away from the strip. The electrodes 3 are connected to a power source 6 through wires 7 . The power supply is 250kW, and the pulse frequency is 20-25kHz. In order to prevent the current short circuit between the adjacent opposite electrodes, between the electrode 3 and the zinc solution 8, and between the adjacent opposit...

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Abstract

The invention relates to a pulse electromagnet assisted plating hot dip plating method. The method comprises the steps of applying a pulse electromagnetic field to the coating formation position, and then applying a pulse magnetic field again to the coating before the bath on a plated piece is not completely solidified. The method relies on the pulse dynamic magnetic fields to carry out local electromagnetic stirring of the zinc fused mass near the coating of a hot dip steel plate, thereby thinning the hot galvanizing coating crystal, improving the binding force between the coating and a substrate and the compactness of the coating, and consequently reaching the aim of improving the quality of the coating of the hot dip steel plate. The method has important application value in the field of the hop dip galvanizing or aluminizing of bands or wires, and bright generalization prospect.

Description

[0001] This application is a divisional application of an invention patent application with an application date of May 30, 2006, an application number of 200610027087.7, and a title of "electromagnetic assisted plating hot-dip plating method and device". technical field [0002] The invention relates to a hot-dip plating method and a device, in particular to an electromagnetic-aided hot-dip plating method and a device. Background technique [0003] Hot-dip coating is a production technology for steel plate surface protection, which mainly requires the coating to be flat, dense, and tightly bonded to the strip steel substrate to achieve aesthetics, protection, and improve subsequent stamping performance. Defects such as coating peeling, powdering, cracking, and insufficient coating that often occur in actual production are essentially caused by poor bonding between the coating and the substrate during hot-dip plating and the low density of the coating itself, which directly af...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C2/00C23C2/24
Inventor 温宏权
Owner BAOSHAN IRON & STEEL CO LTD
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