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Halogen-free flame retarding epoxy resin composition

A technology of epoxy resin and composition, which is applied in the field of halogen-free flame-retardant epoxy resin composition, can solve the problems of poor heat resistance and dielectric properties of the composition, and achieve improved heat resistance and excellent flame retardancy , the effect of avoiding pollution

Inactive Publication Date: 2009-11-18
VENTEC ELECTRONICS SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, domestic and foreign studies are more on the reaction of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and its derivative ODOPB with liquid epoxy resin to synthesize different phosphorus-containing compounds. A large amount of phosphorus-containing epoxy resin, and is equipped with curing agent and other additives to obtain a halogen-free flame-retardant epoxy resin composition, but limited by the composition formula, the heat resistance and dielectric properties of the composition are poor

Method used

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  • Halogen-free flame retarding epoxy resin composition
  • Halogen-free flame retarding epoxy resin composition

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Embodiment 1

[0018] The halogen-free flame-retardant epoxy resin composition according to this embodiment is uniformly stirred by the following proportioning components:

[0019] 100 parts by weight of phosphorus-containing epoxy resin, model 92547 (01), solid content 60%, phosphorus content 2%;

[0020] 100 parts by weight of styrene-maleic anhydride copolymer (m / n=1, Mw=2000);

[0021] 0.1 parts by weight of 2-methylimidazole.

Embodiment 2

[0023] The halogen-free flame-retardant epoxy resin composition according to this embodiment is uniformly stirred by the following proportioning components:

[0024] 100 parts by weight of phosphorus-containing epoxy resin, model 92547 (03), solid content 60%, phosphorus content 4%;

[0025] 100 parts by weight of styrene-maleic anhydride copolymer (m / n=1, Mw=2000);

[0026] 0.1 parts by weight of 2-methylimidazole.

Embodiment 3

[0028] The halogen-free flame-retardant epoxy resin composition according to this embodiment is uniformly stirred by the following proportioning components:

[0029] 100 parts by weight of phosphorus-containing epoxy resin, model 92547 (05), solid content 60%, phosphorus content 4.7%;

[0030] Styrene-maleic anhydride copolymer (m / n=4, Mw=3000) 125 parts by weight;

[0031] 0.1 parts by weight of 2-methylimidazole.

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Abstract

The invention relates to a halogen-free flame retarding epoxy resin composition, which contains a phosphorus-containing epoxy resin, a curing agent, a curing accelerator and a solvent. The composition is characterized in that the composition contains the phosphorus-containing epoxy resin, the curing agent and the curing accelerator with the weight ratio of 1:1-1.5:0.001-0.05; and the mass percentage of the phosphorus in the phosphorus-containing epoxy resin is 2-6%. The epoxy resin composition has excellent dielectric property, meets the halogen-free flame-retarding environmental-protection requirement, and improves the heat resistance performance (with the highest heat resistant temperature of 400 DEG C) of the substrate and the humidity resistance performance.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to a halogen-free flame-retardant epoxy resin composition with low dielectric constant and suitable for making printed circuit boards. Background technique [0002] The society is developing toward a high degree of informationization and the advent of the 3G era has put forward higher requirements for the signal transmission performance of printed circuit boards (PCBs). The key factors affecting the signal transmission of PCB boards are the dielectric constant (Dk) and dielectric loss factor (Df) of non-conductive materials and the skin effect of conductive materials. The smaller the dielectric constant and dielectric loss factor, the better it is to improve the signal. Transmission speed and improve the quality of signal transmission. [0003] In the prior art, the epoxy resin system with low dielectric constant uses high-bromine epoxy resin or multifunctional epoxy resin as the main ...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L25/08C08K5/3445C08K3/22
Inventor 王琢
Owner VENTEC ELECTRONICS SUZHOU
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