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Dry surface modification method for electronic grade super-fine silicon micro-powder

A surface modification, ultra-fine silicon technology, applied in the direction of dyeing organosilicon compound treatment, fibrous fillers, etc., can solve the problems of large specific surface area, high surface energy, easy agglomeration, etc., to improve compatibility and improve bonding force , The effect of good arc resistance

Active Publication Date: 2013-03-20
JIANGSU NOVORAY NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the surface modification of silica powder is mainly aimed at ordinary silica powder with relatively coarse particle size, while for ultra-fine silica powder, because of its large specific surface area, high surface energy, easy agglomeration, and difficult dispersion, it is necessary to achieve continuous production. The dry surface modification process is to overcome many technical, process, equipment and other problems. At present, there is no large-scale production line for continuous production of ultrafine silica powder dry surface modification process in China.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Example 1. A dry surface modification method of electronic grade ultrafine silica powder, the steps are as follows:

[0016] (1) Select ultrafine silica powder with D50=3-50 μm as raw material;

[0017] (2) Prepare surface modification mixed liquid; described surface modified mixed liquid is made up of the raw material of following weight ratio: silane coupling agent 80%; Silane surfactant 12%; Macromolecular hyperdispersant 8%;

[0018] (3) After heating the raw material to 80°C, add 0.3% surface modification mixed liquid to the raw material to coat and modify the raw material, keep it warm for 30 minutes, discharge and cool the raw material to obtain the finished product.

Embodiment 2

[0019] Example 2. A dry surface modification method of electronic grade ultrafine silica powder, the steps are as follows:

[0020] (1) Select ultrafine silica powder with D50=3-50 μm as raw material;

[0021] (2) preparing a surface modification mixed solution; the surface modified mixed solution is made of the following raw materials in weight ratio: 90% of silane coupling agent; 6% of silane surfactant; 4% of polymer hyperdispersant;

[0022] (3) After heating the raw material to 145° C., adding 3.0% of the surface modification mixed liquid to the raw material by weight, coating and modifying the raw material, keeping the temperature for 120 minutes, and then discharging and cooling to obtain the obtained product.

Embodiment 3

[0023] Example 3. A dry surface modification method of electronic grade ultrafine silica powder, the steps are as follows:

[0024] (1) Select ultrafine silica powder with D50=3-50 μm as raw material;

[0025] (2) Prepare surface modification mixed liquid; described surface modified mixed liquid is made up of the raw material of following weight ratio: 88% of silane coupling agent; 10% of silane surfactant; 2% of macromolecular hyperdispersant;

[0026] (3) After heating the raw material to 130° C., adding 1.5% of the surface modification mixed liquid to the raw material by weight, coating and modifying the raw material, keeping the material warm for 60 minutes, and then discharging and cooling to obtain the finished product.

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Abstract

The invention discloses a dry surface modification method for electronic grade super-fine silicon micro-powder, comprising the following steps: selecting super-fine silicon micro-powder with the D50 of 3-50 microns as raw materials; preparing a surface modification mixed solution from the following raw materials by weight percent: 80-90% of silane coupling agent, 6-12% of silane surfactant and 2-8% of polymeric dispersant; heating the raw materials to 80-145 DEG C, and adding the surface modification mixed solution accounting for 0.3-3.0% of the weight of raw materials into the raw materials; carrying out a coating modification on the raw materials; keeping temperature for 30-120 minutes, discharging and cooling to obtain the electronic grade super-fine silicon micro-powder with modified surface. The invention modifies the surface of the super-fine powder, effectively solves the problem of dispersity of the super-fine powder and greatly improves the dispersity, the compatibility of the super-fine powder and an organic polymer i.e. oxygen resin and the binding force of inorganic super-fine powder and organic materials.

Description

technical field [0001] The invention relates to a method for treating silicon micropowder, in particular to a dry method surface modification method for electronic grade ultrafine silicon micropowder. Background technique [0002] Surface modification or Surface treatment of powder refers to the use of physical, chemical, mechanical and other methods to treat the surface of powder materials, and to change the physical and chemical properties of the surface of powder materials according to the needs of the application. Composition, structure and functional groups, photoelectric properties, reaction characteristics, etc., to meet the needs of modern new materials, new processes and new technology development. [0003] At present, the surface modification process of microsilica powder mainly includes wet method and dry method. The wet process has the disadvantages of high labor intensity, high energy consumption, environmental pollution, poor particle dispersion, long producti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09C1/28C09C3/12
Inventor 李晓冬
Owner JIANGSU NOVORAY NEW MATERIAL CO LTD
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