Encapsulating structure and encapsulating method for reconfiguring chip

Abstract

The invention relates to an encapsulating structure and an encapsulating method for reconfiguring a chip. The encapsulating structure comprises a plurality of welding pads configured on an active surface of the chip; first polymer material layers covering on the active surface of the chip and exposing the plurality of the welding pads; a plurality of conductive columns configured among the first polymer material layers and electrically connected with each welding pad; a sealing compound body for coating the chip and exposing the polymer material layers and the conductive columns; a second polymer material layer covering on the first polymer material layers and the sealing compound body and exposing the plurality of the conductive columns; a plurality of fan-out metal wire sections which are configured above the second polymer material layer and of which one ends of the metal wire sections electrically are connected with the conductive columns; and a plurality of conductive elements electrically connected with the other ends of the metal wire sections.

Description

technical field [0001] The invention relates to a semiconductor packaging method, in particular to a packaging method for reconfiguring chips with different sizes and functions. Background technique [0002] Semiconductor technology has developed quite rapidly, so the miniaturized semiconductor chip (Dice) must have diversified functional requirements, so that the semiconductor chip must be configured with more input / output pads (I / O pads) in a small area. O pads), so that the density of metal pins (pins) is also rapidly increased. Therefore, the early lead frame packaging technology is no longer suitable for high-density metal pins; therefore, a ball array (BallGrid Array: BGA) packaging technology has been developed. In addition to the advantages of higher density than lead frame packaging, ball array packaging , and its tin balls are less likely to be damaged and deformed. [0003] With the popularity of 3C products, such as: mobile phone (Cell Phone), personal digital ...

AI Technical Summary

Problems solved by technology

This thinned chip is relocated on another substrate, and then multiple chips are formed into a package by injection molding; because the chip is very thin, the package is also very thin, so when the package is detached After the substrate, the stress of the encapsulant itself will cause the encapsulant to warp, increasing the difficulty of the subsequent cutting process

[0006] In addition, after the wafer is diced, when it is reconfigured on another substrate, since the size of the new substrate is larger than the original size, it will not be aligned in the subsequent ball planting process, and the reliability of the packaging structure will be reduced.

For this reason, the present invention provides a soldering pad on which the copper column is formed in advance on the chip, and then the copper column is exposed through the thinning process, so that it can effectively solve the problems of misalignment during ball planting and warping of the encapsulant question

[0007] In addition, during the entire packaging process, there will also be a problem that the manufacturing equipment will generate excessive local pressure on the chip during ball planting, which may damage the chip; at the same time, it may also be caused by the material of the ball planting. The resistance value between the pads becomes larger, which affects the performance of the chip and other issues

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