Daiamid epoxy curing agent and preparation method thereof
A polyamide epoxy and curing agent technology, applied in electrophoretic coatings and other directions, to achieve the effects of scientific and reasonable preparation method, good performance, and stable effective performance
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Embodiment 1
[0015] The components of the raw materials are expressed in parts by weight: 20 parts of dimer fatty acid, 8 parts of ricinoleic acid, 12 parts of ethylenediamine or diethylenetriamine, 15 parts of acetone or butanone, and 0.01 part of quinone.
[0016] The preparation method process is as follows:
[0017] According to the ratio of raw materials, in the pass N 2 Add dimer fatty acid, ricinoleic acid and ethylenediamine or diethylenetriamine into the reaction kettle, then stir the mixture for 30 minutes; then heat up to dehydration, continue heating to 180°C, keep the reaction for 1 hour, cool to 100°C and add Acetone or methyl ethyl ketone, heat up and reflux for 1 hour; after the reflux, heat to recover free acetone or methyl ethyl ketone, keep at 150°C for 1 hour, cool to 180°C and add terminator, then vacuumize, the vacuum degree reaches -0.08MPa (vacuum Figures on the table), keep 0.5 hours; finally cool to 120 ° C, discharge, to obtain ketimidized polyamide epoxy curing...
Embodiment 2
[0019] The components of the raw materials are expressed in parts by weight: 65 parts of dimer fatty acid or trimer fatty acid, 30 parts of cotton oleic acid, 35 parts of triethylenetetramine or tetraethylenepentamine, 32 parts of cyclohexanone or methyl isobutyl ketone part, 0.02 part of boric acid.
[0020] The preparation method process is as follows:
[0021] According to the ratio of raw materials, in the pass N 2 Add dimer fatty acid, cottonoleic acid and triethylenetetramine or tetraethylenepentamine to the reaction kettle, then stir the mixture for 90 minutes; then heat up to dehydration, continue heating to 300°C, keep the reaction for 5 hours, and cool to 135°C Add ketones, heat up and reflux for 10 hours; after reflux, heat to recover free ketones, keep at 250°C for 2 hours, cool to 200°C, add terminator, and then vacuum, the vacuum degree reaches -0.1MPa (the number on the vacuum gauge Shown), kept for 3 hours; finally cooled to 120 ° C, discharged, to obtain ket...
Embodiment 3
[0023] The components of the raw materials are expressed in parts by weight: 40 parts of dimer fatty acid or other poly fatty acid, 10 parts of rapeseed acid, 15 parts of polyethylene polyamine, 20 parts of methyl ethyl ketone, and 0.01 part of aryl polyhydroxy compound terminator.
[0024] The preparation method process is as follows:
[0025] According to the ratio of raw materials, in the pass N 2 Add dimer fatty acid, rapeseed oleic acid and polyethylene polyamine into the reaction kettle, then stir the mixture for 45 minutes; then raise the temperature to dehydration, continue heating to 220°C, keep the reaction for 3 hours, cool to 110°C and add ketones, Heat up and reflux for 4 hours; reheat to recover free ketones after reflux, keep at 170°C for 1.5 hours, cool to 190°C and add terminator, then vacuumize, the vacuum degree reaches -0.09MPa (digital display on the vacuum gauge), keep 1.5 hours; finally cooled to 120°C and discharged to obtain a ketimidated polyamide ep...
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