Heat-radiating substrate for alternating current LED light source

Abstract

The invention discloses a heat-radiating substrate for an alternating current LED light source, which comprises a bottom layer, an insulating layer which is arranged on the bottom layer and can bear mechanical and thermal stress, a conductive layer which is arranged on the insulating layer and distributed with a conductive circuit and an electrode pad, and the LED light source embedded in a fixedslot of the heat-radiating substrate. The heat-radiating substrate is characterized in that the bottom layer is a graphite layer with size stability and heat radiation, or when the bottom layer is made of the conventional thermal conductive base materials, the graphite layer is embedded in the bottom layer which is positioned under a heat sink of the LED light source, the heat sink of the LED light source penetrates the bottom of the fixed slot and is in contact with the surface of the graphite layer, and the periphery of the heat sink is bonded with insulating media of the insulating layer, thereby constituting the heat-radiating substrate with the three-layer structure. The heat-radiating substrate can effectively solve the thermal conductive performance, the electrical insulating performance and the mechanical processing performance of a printed circuit board, thereby being widely applied in heat transfer media of electronic devices and improving the working stability.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a heat dissipation substrate structure for an AC LED light source, and belongs to the technical field of printed circuit boards. Background technique [0002] In the development of packaging technology, function improvement and miniaturization have resulted in higher and higher heat density. Some LED products cannot dissipate enough heat only by packaging design, and the heat dissipation function must be enhanced by PCB design. At present, the heat sink substrates used in general heat dissipation materials (such as civilian high-end electronic devices, LED chip materials, heat exchangers for industrial equipment, etc.) are almost all aluminum alloys, but aluminum is not the metal with the highest thermal conductivity. Gold and silver have better thermal conductivity, but the disadvantage is that the price is too high. The heat dissipation effect of pure copper is second, but in additio...

AI Technical Summary

Problems solved by technology

Gold and silver have better thermal conductivity, but the disadvantage is that the price is too high

The heat dissipation effect of pure copper is second, but in addition to the high cost, the copper sheet is heavy and not resistant to corrosion. Once the copper is oxidized, its thermal conductivity and heat dissipation performance will be greatly reduced, resulting in high temperature and increasing the LED failure. Possibility, resulting in increased LED light decay and shortened life

[0003] At this stage, one disadvantage of AC LED light sources is the risk of electric shock. For high voltages (that is, AC vo

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