Chemical mechanical polishing solution
A chemical machinery and polishing liquid technology, applied in the field of polishing liquid, can solve the problems of corrosion of metal and dielectric materials, difficult chemical removal of low-dielectric materials, etc., and achieve the effect of improving removal rate and good effect.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 16
[0065] The polishing liquid of embodiment 16 sees in the micrograph after polishing of TEOS854 pattern wafer figure 1 , it can be seen that there is particle residue on the polished wafer.
Embodiment 20
[0066] The polishing fluid of embodiment 20 is to the micrograph after polishing of TEOS854 pattern wafer see figure 2 , it can be seen that the surface of the polished wafer is smooth and smooth without particle contamination.
[0067] Summary: The polishing solution of the present invention maintains a high removal rate of the dielectric material while causing little or no surface contamination, and the surface of the polished material is smooth and has high flatness.
PUM
Property | Measurement | Unit |
---|---|---|
particle diameter | aaaaa | aaaaa |
particle diameter | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com