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Method for preparing pinpoint of nano-tungsten probe

A probe tip and nano-tungsten technology, which is applied in nanotechnology, nanotechnology, nanostructure manufacturing, etc., can solve the problems of complicated manufacturing process, low success rate, and small output

Inactive Publication Date: 2010-04-21
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned production process is quite complicated, and the cost is high, the output is small, and the success rate is low.

Method used

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  • Method for preparing pinpoint of nano-tungsten probe
  • Method for preparing pinpoint of nano-tungsten probe
  • Method for preparing pinpoint of nano-tungsten probe

Examples

Experimental program
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Effect test

Embodiment 1

[0018] 1) Configure a NaOH solution with a concentration of 5mol / L as the corrosion solution, take an appropriate amount and pour it into the corrosion pool and a beaker; select a tungsten wire with a diameter of 0.2mm, cut off a length of 3-4cm as needed, and place it with tweezers In the aforementioned beaker, add an AC voltage of 15V to corrode and remove the oxide layer on the surface of the tungsten wire (WO 3 );

[0019] Insert the tungsten wire into the corrosion pool with a depth of 1mm, and control the corrosion voltage through the corrosion circuit, which is 5V DC. After 12 minutes of etching, the nano-tungsten tip is formed under the dominance of the "neck-in" phenomenon, and the instantaneous corrosion circuit formed at the tip is automatically cut off. The response time is within 600-700ns, and the curvature radius of the tungsten tip is Between 20nm-50nm;

[0020] 2) After carefully removing the tungsten needle tip, rinse it with a large amount of deionized wat...

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Abstract

The invention discloses a method for preparing a pinpoint of a nano-tungsten probe, which comprises the following steps: 1) after removing an oxide layer on the surface of a tungsten filament by using an etching solution, inserting the tungsten filament into the etching solution, energizing the etching solution, and corroding the tungsten filament; 2) after washing the tungsten filament corroded in the step 1) by using deionized water and performing ultraphonic treatment, washing and drying the tungsten filament by using alcohol; and 3) coating an insulating varnish on the surface of the tungsten filament processed in the step 2), and drying and standing the tungsten filament to prepare the pinpoint of the nano-tungsten probe. The radius of curvature of the tip of the pinpoint of the nano-tungsten probe can reach about 20 nanometers minimally, and the pinpoint of the nano-tungsten probe can form tip conduction at a small voltage (1 mV magnitude). The method has a low preparation cost, and has a good application prospect in the study fields of nanometer channels, nano fluidonics, subcellular electrical measurement and the like.

Description

technical field [0001] The invention relates to a nano metal probe, in particular to a method for preparing a nano tungsten probe tip. Background technique [0002] With the widespread use of scanning probe microscopes in the fields of physics, chemistry, biology, and microelectronics, the requirements for probes are also increasing. As a kind of sensing probe with good ductility and high hardness, metal nanoprobe plays an extremely important role in signal detection. Compared with platinum and gold materials, in addition to the above advantages, tungsten is easier to process into sharp needle points, and it is economical and convenient. The method of using tungsten needle points to wrap insulating materials is very important in the electrochemical measurement of nanochannels, nanofluids and subcellular structures. All have good application prospects. [0003] The main methods for preparing tungsten tips include electrochemical corrosion, field evaporation, mechanical shea...

Claims

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Application Information

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IPC IPC(8): G01Q70/16B82B3/00
Inventor 许胜勇邹高武庄虔伟洪一帆牟彤林
Owner PEKING UNIV
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