Preparation method of silver-plated copper powder

A silver-plated copper powder and copper powder technology, which is applied in the direction of coating, etc., can solve the problems of complex components of the plating solution, many times of plating, and poisonous silver cyanide, and achieve uniform distribution of the silver layer and a single component of the plating solution , the effect of high conversion rate

Inactive Publication Date: 2010-07-14
TIANNUO PHOTOELECTRIC MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned patents on copper powder surface electroless silver plating process exist in varying degrees that the copper powder has not been pre-treated, the composition of the plating solution is complex, the stability is poor, silver cyanide is poisonous, the n

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] a. Put the copper powder with a particle size of 200 mesh into a sodium hydroxide solution with a weight concentration of 15% and stir for 5 minutes to remove the oil stain on the surface of the copper powder, then wash it with tap water for 3 times to neutrality, filter and dry, and set aside;

[0019] b. Put the degreased copper powder in step a into a nitric acid solution with a weight concentration of 3% and stir for 30 minutes to remove oxides on the surface of the copper powder, wash it with tap water for 5 times to neutrality, and then rinse it with acetone , filter, spare;

[0020] c. according to the proportioning by weight of copper powder: silver nitrate=100:10, silver nitrate is added with water and dissolved into silver nitrate aqueous solution; Standby

[0021] d. according to copper powder: ethylenediaminetetraacetic acid monosodium salt = 100:1 weight ratio, ethylenediaminetetraacetic acid monosodium salt is dissolved in water into ethylenediaminetetraac...

Embodiment 2

[0024] a. Put the copper powder with a particle size of 800 mesh into a sodium hydroxide solution with a weight concentration of 3% and stir for 30 minutes to remove the oil stains on the surface of the copper powder, then wash it with tap water 5 times until neutral, filter and dry, and set aside;

[0025] b. Put the degreased copper powder in step a into a nitric acid solution with a weight concentration of 15% and stir for 5 minutes to remove oxides on the surface of the copper powder, wash it with tap water for 3 times to neutrality, and then rinse it with acetone , filter, spare;

[0026] c. according to the proportioning by weight of copper powder: silver nitrate=100:1, silver nitrate is added with water and dissolved into silver nitrate aqueous solution; Standby

[0027] d. according to copper powder: ethylenediaminetetraacetic acid monosodium salt = 100: 10 weight ratio, ethylenediaminetetraacetic acid monosodium salt is dissolved in water into ethylenediaminetetraacet...

Embodiment 3

[0030] a. Put the copper powder with a particle size of 500 mesh into a sodium hydroxide solution with a weight concentration of 15% and stir for 15 minutes to remove the oil stain on the surface of the copper powder, then wash it with tap water 4 times to neutral, filter and dry, and set aside;

[0031] b. Put the degreased copper powder in step a into a nitric acid solution with a weight concentration of 8% and stir for 15 minutes to remove oxides on the surface of the copper powder. After washing with pure water for 4 times until neutral, rinse with acetone One time, filter, reserve;

[0032] c. according to the proportioning by weight of copper powder: silver nitrate=100:5, silver nitrate is added with water and dissolved into silver nitrate aqueous solution; Standby

[0033] d. according to copper powder: ethylenediaminetetraacetic acid monosodium salt = 100:5 weight ratio, ethylenediaminetetraacetic acid monosodium salt is dissolved in water into ethylenediaminetetraacet...

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Abstract

The invention provides a preparation method of silver-plated copper powder, which comprises the following steps: a, putting copper powder of which the granularity is 200-800 meshes into an alkali solution of which the weight concentration is 3-15% for washing with alkali, and then, washing with water, filtering and drying; b, putting the copper powder in the step a into an acid solution of which the weight concentration is 3-15% for washing with acid, washing with water to the neutrality, and then, filtering and drying; c, under the condition that the proportion by weight of copper powder to silver nitrate is 100:1-10, taking the silver nitrate, and dissolving the silver nitrate into water to form a silver nitrate water solution; d, under the condition that the proportion by weight of copper powder to ethylenediamine tetraacetic acid disodium salt is 100:1-10, taking the ethylenediamine tetraacetic acid disodium salt, dissolving the ethylenediamine tetraacetic acid disodium salt into water to form a water solution, putting the copper powder in the step b into the water solution for uniformly stirring, then adding the silver nitrate water solution in the step c and 0.05-5% copper powder weight of reducing agent for reacting for 0.5-4 hours, and cleaning, centrifuging and filtering to obtain the silver-plated copper powder; and e, adding the silver-plated copper powder after reaction into an organic acid ester mixed solution for soaking for 0.5-3 hours, and filtering and drying to obtain a product.

Description

Technical field: [0001] The invention relates to the technical fields of materials and chemicals, in particular to a preparation method of high-performance silver-plated copper powder. technical background: [0002] With the development of electronics, information, and communication industries, the miniaturization, multi-functionalization, and multi-layering of electronic components are accelerating. For electronic pastes with gold, silver, copper, nickel and other metal powders as the main conductive particles (Conductive coatings, conductive glue, conductive rubber, etc.) are in increasing demand. Electronic paste has been widely used in the fields of electrodes of electronic components and shielding coatings for preventing electromagnetic interference. Silver-based conductive paint is one of the earliest developed varieties, but its price is expensive, and silver ions are prone to electromigration under hot and humid conditions, which limits its application. Copper powd...

Claims

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Application Information

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IPC IPC(8): B22F9/18B22F1/02
Inventor 朱焰焰于名讯余凤斌
Owner TIANNUO PHOTOELECTRIC MATERIAL
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