Preparation method of silver-plated copper powder

Abstract

The invention provides a preparation method of silver-plated copper powder, which comprises the following steps: a, putting copper powder of which the granularity is 200-800 meshes into an alkali solution of which the weight concentration is 3-15% for washing with alkali, and then, washing with water, filtering and drying; b, putting the copper powder in the step a into an acid solution of which the weight concentration is 3-15% for washing with acid, washing with water to the neutrality, and then, filtering and drying; c, under the condition that the proportion by weight of copper powder to silver nitrate is 100:1-10, taking the silver nitrate, and dissolving the silver nitrate into water to form a silver nitrate water solution; d, under the condition that the proportion by weight of copper powder to ethylenediamine tetraacetic acid disodium salt is 100:1-10, taking the ethylenediamine tetraacetic acid disodium salt, dissolving the ethylenediamine tetraacetic acid disodium salt into water to form a water solution, putting the copper powder in the step b into the water solution for uniformly stirring, then adding the silver nitrate water solution in the step c and 0.05-5% copper powder weight of reducing agent for reacting for 0.5-4 hours, and cleaning, centrifuging and filtering to obtain the silver-plated copper powder; and e, adding the silver-plated copper powder after reaction into an organic acid ester mixed solution for soaking for 0.5-3 hours, and filtering and drying to obtain a product.

Description

Technical field: [0001] The invention relates to the technical fields of materials and chemicals, in particular to a preparation method of high-performance silver-plated copper powder. technical background: [0002] With the development of electronics, information, and communication industries, the miniaturization, multi-functionalization, and multi-layering of electronic components are accelerating. For electronic pastes with gold, silver, copper, nickel and other metal powders as the main conductive particles (Conductive coatings, conductive glue, conductive rubber, etc.) are in increasing demand. Electronic paste has been widely used in the fields of electrodes of electronic components and shielding coatings for preventing electromagnetic interference. Silver-based conductive paint is one of the earliest developed varieties, but its price is expensive, and silver ions are prone to electromigration under hot and humid conditions, which limits its application. Copper powd...

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned patents on copper powder surface electroless silver plating process exist in varying degrees that the copper powder has not been pre-treated, the composition of the plating solution is complex, the stability is poor, silver cyanide is poisonous, the number of platings is high, and the surface of the copper powder needs to be sensitized and activated, etc. Moreover, during the plating process, the silver layer is easily deposited on the inner wall of the plating tank, resulting in the waste of silver and other disadvantages.