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A photosensitive resin composition and a method forming a pattern using the same

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve problems such as long drying time, achieve the effect of uniform film thickness, good performance and reduction of processes

Active Publication Date: 2010-08-04
MERCK PATENT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the drying method of the coating film of the composition, since it is left at room temperature for several hours to several days, or is dried by hot air or infrared electrodes for tens of minutes to several hours, although VCD is not used in drying the coating film, there are The problem of long drying time at room temperature

Method used

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  • A photosensitive resin composition and a method forming a pattern using the same
  • A photosensitive resin composition and a method forming a pattern using the same
  • A photosensitive resin composition and a method forming a pattern using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] 2,3,4,4'-Tetrahydroxybenzophenone and 1, 25 parts by weight of the esterified product of 2-naphthoquinonediazide-5-sulfonyl chloride is used as a sensitizer, and a fluorosurfactant (nonionic surface active agent produced by Dainippon Ink Chemical Industry Co., Ltd. Active agent), then add a mixed solvent (mixing weight ratio: 90:10) of propylene glycol monomethyl ether acetate (PGMEA) and n-butyl acetate (nBA) (boiling point 126.1 ° C, evaporation rate 100), stir with 0.2 μm filter was used to prepare photosensitive resin composition 1 having a solvent content of 86% by weight.

Embodiment 2

[0056] Except that the solvent is replaced by a mixed solvent (mixing weight ratio of 70:30) of propylene glycol monomethyl ether acetate (PGMEA) and n-butyl acetate (nBA) (boiling point 126.1 ° C, evaporation rate 100), the same as in Example 1 It carried out similarly, and the photosensitive resin composition 2 was obtained.

Embodiment 3

[0058] Except that the solvent is replaced by a mixed solvent (mixing weight ratio of 50:50) of propylene glycol monomethyl ether acetate (PGMEA) and n-butyl acetate (nBA) (boiling point 126.1 ° C, evaporation rate 100), the same as in Example 1 It carried out similarly, and the photosensitive resin composition 3 was obtained.

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Abstract

Provided is a photosensitive resin composition, which has short drying time, no coating unevenness and uniform coating film thickness when the pressure reduction drying or vacuum drying method are not adopted to perform natural drying after narrow slit coating, and has good against corrosion pattern shape after exposure and developing. The photosensitive resin composition adopting a photosensitive resin composition containing alkali soluble phenolic resin, photosensitizer containing quinone diazido, and a mixed solvent of propylene glycol monomethyl ether acetate (A) and a solvent (B) whose boiling point is below 145 DEG C and n-butyl acetate evaporation velocity is more than 50, is coated on the substrate through a narrow slit coating method, dried without adopting a pressure reduction drying or vacuum drying method, and then exposure and developing are performed to form anticorrosion patterns.

Description

technical field [0001] The present invention relates to a photosensitive resin composition suitable for slit coating, a method for forming a resist pattern by a slit coating method, a method for manufacturing a substrate for a flat panel display (FPD), and a flat panel display produced by the method Substrate and flat panel display using it. Background technique [0002] In the manufacturing process of semiconductor integrated circuit elements, solid-state image sensor elements, color filters, and flat panel displays (FPD) such as liquid crystal display elements (LCD) and plasma displays (PDP), photosensitive resin compositions are used for resisting film, protective film, planarizing film for flattening the surface of the device, insulating film for maintaining electrical insulation, etc. The photosensitive resin composition is coated on various substrates depending on the purpose of use. As coating methods, spin coating, roll coating, primer coating (land coat method), fl...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/00
CPCG03F7/022G03F7/0385G03F7/115G03F7/16H01L21/0271
Inventor 能谷敦子远山宜亮
Owner MERCK PATENT GMBH
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