P type lateral insulated gate bipolar device for reducing hot carrier effect
A technology of bipolar devices and hot carriers, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems affecting the service life of devices, prolong the degradation life, fully compatible with the integrated circuit manufacturing process, and reduce ion generation rate effect
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[0024] Attached below figure 1 , the present invention is described in detail, a P-type lateral insulated gate bipolar device that reduces the hot carrier effect, comprising: an N-type substrate 1, a buried oxygen 2 is arranged on the N-type substrate 1, and a buried oxygen 2 is provided with an N-type epitaxial layer 3, a P-type well 4 and an N-well region 13 are provided on the N-type epitaxial layer 3, a P-type buffer well 5 is provided on the P-type well 4, and a P-type buffer well 5 is provided on the P-type buffer well 5. An N-type positive region 6 is provided, a P-type negative region 12 and an N-type body contact region 11 are arranged on the N well region 13, and a gate oxide layer 10 is arranged on the surface of the N-type epitaxial region 3, and the gate oxide layer 10 is formed from N The epitaxial region 3 extends to the P-type well region 4, and a field oxide layer 8 is provided in the area other than the N-type anode region 6, the N-type body contact region 1...
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