The invention relates to the technical field of a
semiconductor device, and relates to a GaN
heterojunction longitudinal field effect
transistor. The GaN
heterojunction longitudinal field effect
transistor is characterized in that a longitudinal discrete
grating structure is utilized, and a schottky source
electrode is deposited between grids to form an
anode of a reverse conducting
diode; by introducing back barriers and grooved gates formed in P type base regions, the two dimensional
electron gas (2DEG) at the channel below the gate is used up through the combined action of the back barriers and the grooved gates, and the threshold-
voltage can be accurately regulated and controlled by adjusting the
etching thickness of an AlMN
barrier layer. In the working state of a forward direction switch, the GaN
heterojunction longitudinal field effect
transistor has the advantages of being adjustable in the threshold-
voltage, being low in the conduction resistance, being large in the
saturation current, being high in the off state withstand
voltage, being high in the working frequency and being low in
power consumption. In the reverse conducting state, the GaN heterojunction longitudinal
field effect transistor has the advantages of being low in the starting voltage, being low in the conduction resistance, being high in the reverse withstand voltage, being short in the
reverse recovery time and being low in
power consumption. And at the same time, the manufacturing technique of the GaN heterojunction longitudinal
field effect transistor is compatible with a traditional GaN heterojunction HEMT device. The GaN heterojunction longitudinal
field effect transistor is especially suitable for a GaN heterojunction longitudinal power
field effect transistor.