Sputtering target for magnetic recording film and method for manufacturing such sputtering target
A manufacturing method and a technology of sputtering targets, which are applied in the field of sputtering targets, can solve problems such as density without specific research, and achieve the effects of high-speed film formation, easy acquisition, and high efficiency
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Embodiment 1
[0101] By using an ultra-small gas atomization device (manufactured by Nisshin Technological Co., Ltd.), 50kg / cm was sprayed on 2kg of CoCr alloy at a bath temperature of 1650°C (measured with a radiation thermometer). 2 Argon (Ar) was used for gas atomization to obtain a powder. The obtained powder is a spherical powder with an average particle diameter of 150 μm or less.
[0102] Then, using the obtained powder, and TiO 2 The powder (average particle diameter: about 0.5 μm) was mechanically alloyed with a ball mill to obtain a powder (A).
[0103] In the obtained powder (A), the same powders as Pt powder (average particle size about 0.5 μm) and Co powder were added respectively, and Co 66 Cr 10 Pt 15 (TiO 2 ) 9 The composition ratio was mixed to obtain a powder (B). Mixed using a ball mill.
[0104] The obtained powder (B) was further sized using a vibrating sieve.
[0105] Next, the powder (B) was put into a molding die, and sintered under the following conditions ...
Embodiment 5~7
[0126] [Examples 5-7, Reference Examples 3-4]
[0127] Use SiO 2Powder (average particle size about 0.5μm) to replace TiO 2 The powder was mixed at the composition ratio shown in Table 1 to obtain powder (B), and a φ4-inch sputtering target was obtained in the same manner as in Example 1 except for the sintering conditions shown in Table 1. Table 1 shows various measurement results using these sintered bodies.
Embodiment 8~9
[0129] use it 2 o 5 Powder (average particle size about 0.5μm) to replace TiO 2 The powder was mixed at the composition ratio shown in Table 1 to obtain powder (B), and a φ4-inch sputtering target was obtained in the same manner as in Example 1 except for the sintering conditions shown in Table 1. Table 1 shows various measurement results using these sintered bodies.
[0130] [Table 1]
[0131]
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