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A kind of cyanide-free gold plating electroplating solution

A cyanide-free gold plating and electroplating solution technology, applied in the field of gold plating solution, can solve the problems of high toxicity, high cost, instability of cyanide-free gold plating solution, etc., and achieve the effect of fine grain, bright bonding force and simple operation

Inactive Publication Date: 2011-11-30
FUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a cyanide-free gold-plating electroplating solution and an electroplating additive system for gold plating, which solves the problems of instability, high cost and high toxicity of the cyanide-free gold-plating solution

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] When using the following cyanide-free gold plating solution for electroplating, select the nickel electrode as the cathode and the platinum sheet as the anode. Adjust the temperature to a predetermined value at a current density of 0.1 A / dm 2 ~0.6 A / dm 2 Under plating.

[0021] The composition of the gold plating solution is as follows:

[0022] Sodium Chloraurate 10.9 g / L

[0023] Adenine 24.3 g / L

[0024] KNO 3 10.1g / L

[0025] KOH 56.1 g / L

[0026] Lead nitrate 0.3 g / L

[0027] Current density 0.1 A / dm 2

[0028] pH 13.5

[0029] Bath temperature 40°C

[0030] According to the electroplating step in the specific embodiment, the electroplating operation is performed using the cyanide-free gold plating electroplating solution. As a result, the nickel electrodes were plated with gold.

Embodiment 2

[0032] Gold plating with the method same as embodiment 1, change the composition of gold plating solution, pH, current density, bath temperature, as a result nickel electrode has been plated with gold.

[0033] Sodium gold sulfite 12.8 g / L

[0034] Adenine 24.3 g / L

[0035] NaNO 3 8.5g / L

[0036] NaOH 40g / L

[0037] L-cysteine ​​0.2 g / L

[0038] Current density 0.2 A / dm 2

[0039] pH 12

[0040] Bath temperature 55°C

Embodiment 3

[0042] Gold plating with the method same as embodiment 1, change the composition of gold plating solution, pH, current density, bath temperature, as a result nickel electrode has been plated with gold.

[0043] Sodium gold sulfite 12.8 g / L

[0044] Adenine 24.3 g / L

[0045] KNO 3 10.1g / L

[0046] KOH 56.1 g / L

[0047] Potassium selenocyanide 0.12 g / L

[0048] Current density 0.15 A / dm 2

[0049] pH 13

[0050] Bath temperature 55°C

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PUM

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Abstract

The invention provides a cyanide-free gold-plating solution and various additives suitable for the gold-plating system. The components of the formula of the cyanide-free gold-plating solution are: gold inorganic salt 1-50g / L, complexing agent purine 1-200 g / L of analogous compounds and their derivatives, 1-100 g / L of supporting electrolyte, 0-200 g / L of pH regulator and gold plating additive system. The operating conditions for using the cyanide-free gold plating solution are as follows: the pH range is 10-14, the current density is 0.1 A / dm2-0.6 A / dm2, and the temperature is 20-60 degrees. The invention has the advantages of low or no toxicity of the plating solution, good stability of the plating solution, and low replacement rate with metal substrates such as nickel and copper. The coating has good adhesion and brightness, and can be used in various fields such as decorative electroplating and functional electroplating.

Description

technical field [0001] The invention relates to a gold plating solution, in particular to a cyanide-free electroplating solution for gold plating containing a gold salt and a cyanide-free compound. Background technique [0002] Gold has high chemical stability and can only be dissolved in aqua regia, but not in other acids. The gold coating has strong corrosion resistance and good resistance to deformation. At the same time, the gold coating has a variety of colors, so it is widely used in plating jewelry, watch parts, artworks, etc. At the same time, gold has good electrical conductivity, easy welding, high temperature resistance, and certain wear resistance. Therefore, the gold-plated layer is widely used in precision instruments, printed circuit boards, integrated circuits and other parts that require long-term stable electrical parameters. So far, cyanide gold plating is mainly used in domestic and foreign gold plating processes. This is because the cyanide gold plati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/48
Inventor 孙建军陈金水
Owner FUZHOU UNIV
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