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Rapid-curing conductive adhesive composition and method for preparing same

A rapid curing and composition technology, applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve the problems of reduced adhesion and conductivity, reduced work efficiency, increased energy consumption, etc., to improve adhesion and electrical conductivity, reducing corrosion, and good adhesion

Active Publication Date: 2010-10-06
黄文迎 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These products have one or more of the following defects to varying degrees, including: (1) In order to have better fluidity, solvent components are often added, which may cause environmental pollution when using the adhesive composition and harm to human health
(2) The components contain a large amount of amine-containing accelerators, which cause corrosion to the bonded substrate during curing and affect the long-term reliability of the device
(3) The heating and curing time is long, and some products require up to 2 hours or longer, resulting in reduced work efficiency and increased energy consumption
(4) Since the resin part is made of pure epoxy composition, air bubbles are easy to enter during production, packaging and use, and these air bubbles are difficult to automatically remove, especially the tiny air bubbles adhering to the depressions at the edge of the filler are difficult to gather into large air bubbles and are exclusion, resulting in a decrease in adhesion and conductivity after curing

Method used

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  • Rapid-curing conductive adhesive composition and method for preparing same
  • Rapid-curing conductive adhesive composition and method for preparing same
  • Rapid-curing conductive adhesive composition and method for preparing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Step 1. Synthesis of silicon-containing epoxy resin: Pour 2 mol of commercially available 1,2-epoxy-4-vinylcyclohexane and 1 mol of trivinylmethyl polysiloxane (m is 20) into an already In a prepared four-necked round-bottomed flask filled with helium, add 500 mol of tetrahydrofuran solvent under stirring, after mixing uniformly, add 1 mol% of Karstedt catalyst drop by drop, and heat to 120°C. Stirring and constant temperature were maintained for 3 hours. Heating was stopped, the reaction mixture was washed 3 times with 300ml pure water, and then the solvent was distilled off under reduced pressure to obtain oily transparent compound T1 with a yield of 91%. The structural formula of said compound T1 was:

[0034] .

[0035] Step 2. Synthesis of polysiloxane containing phenol groups: Pour 1 mol of dimethoxymethyl hydrogen-containing polysiloxane (n is 6) and 1 mol of p-diphenol into the prepared and helium-filled In a four-necked round-bottomed flask, add 300 mol of ...

Embodiment 2

[0038] Step 1. Synthesis of silicon-containing epoxy resin: Compared with Example 1, except that trivinyl ethyl polysiloxane is used instead of trivinyl methyl polysiloxane, the others are the same. The oily transparent compound T3 was obtained with a yield of 89%.

[0039] Step 2, the synthesis of polysiloxane containing phenol group: Compared with Example 1, except that dimethoxyethyl polysiloxane is used instead of dimethoxymethyl polysiloxane, other is the same , obtain oily compound T4, yield 90%, the structure of said compound T4 is:

[0040] .

[0041] Step 3. Preparation of a fast-curing conductive adhesive composition: 100 grams of the compound T3 synthesized above, 42 grams of T4, 0.5 grams of benzylamine-boron trifluoride complex, 7 ppm of Karstedt catalyst, 1-ethynyl- 1-Cyclohexanol 16ppm, flake silver powder 230g, silver-coated aluminum powder 35g, spherical silver powder 15g, aluminum powder 3g are finely measured, and added to a low-speed mixer for rough mixin...

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Abstract

The invention relates to a rapid-curing conductive adhesive composition and a method for preparing the same. The composition comprises (A) a silicon-containing epoxy resin, (B) polysiloxane containing phenolic groups, (C) a latent curing accelerator, (D) a metal catalyst, (E) a reaction velocity regulator and (F) a filler, wherein the molecule of the silicon-containing epoxy resin at least comprises one ethylene and two 3,4-epoxy cyclohexyl groups; and the molecule of the polysiloxane at least comprises two oxyphenol groups. When used for electric conduction and / or heat conduction and adhesion of chips or devices in micro-electronics, electronics and optoelectronics industries, the adhesive composition has the advantages of reducing the corrosion of the base material and improving the adhesion and the conductivity, along with no solvent and rapid curing.

Description

(1) Technical field [0001] The invention relates to a fast-curing conductive adhesive composition and a preparation method thereof. The adhesive composition is a silicon-containing epoxy composition used in microelectronics, electronics and optoelectronics industries for conducting and / or thermally conducting and bonding chips or devices, and can be cured quickly. (2) Background technology [0002] Epoxy compositions are known for conducting electrical and / or thermal conduction and bonding of chips or devices in the microelectronics, electronics and optoelectronics industries. Commercially available products often mix liquid epoxy resins with curing agents and curing accelerators, and add various conductive or thermally conductive fillers to make paste-like adhesive compositions. These products have one or more of the following defects to varying degrees, including: (1) In order to have better fluidity, solvent components are often added, which may cause environmental pollu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J183/06C09J9/02
Inventor 黄文迎黄云珊
Owner 黄文迎
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