Amorphous silicon film controllable iso-epitaxial growth method
An amorphous silicon thin film, homoepitaxial technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of affecting battery efficiency, difficult to control the crystal orientation of grains, and poor controllability of the crystallization process. Crystallinity controllable effect
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Embodiment 1
[0023] In this embodiment, an amorphous silicon thin film is used as a (111) single crystal silicon substrate, and the crystal size required for epitaxial growth is between 1 nm and 50 nm, which will be adjusted by the duty ratio.
[0024] First place the silicon chip 4 with the amorphous silicon thin film of single crystal made through chemical vapor deposition figure 1 Inside the cavity of the protective container 1 shown. Nitrogen protection is introduced again to prevent the oxidation of the amorphous silicon film. Then use a long-wave YAG laser to perform pulse laser crystallization annealing on the film sample. The wavelength of the long-wave is 1.00-1.10 microns, preferably 1.06 microns. Choose the pulse frequency as 4Hz, 8Hz, 10Hz, 12Hz and 15Hz respectively, keep the output power of the laser at 450w, choose the pulse width of 2ms, and the action time is 30-90s. During operation, the pulse laser at the focal point cannot be used, adjust the spot size, and form a 1×1...
Embodiment 2
[0029] In this embodiment, an amorphous silicon film on a polysilicon substrate is used, and the crystal size required for epitaxial growth is 1-50 nm, which will be adjusted by the duty ratio.
[0030] First the above-mentioned silicon chip 4 with polycrystalline amorphous silicon thin film that chemical vapor deposition makes is placed on figure 1 Inside the cavity of the protective container 1 shown. Argon gas is then introduced to protect the amorphous silicon film from oxidation. Then, pulse laser crystallization annealing is carried out by exciting the sample with long-wave YAG, and the wavelength of the long-wave is 1.06 microns. The frequencies of 4Hz, 8Hz, 10Hz, 12Hz, 15Hz, 20Hz and 25Hz were respectively applied to anneal the amorphous silicon thin film on the polycrystalline silicon substrate. Keep the output power of the laser at 450w unchanged, select a laser pulse with a wavelength of 1.06μm and a pulse width of 2ms, and a laser spot of 1×1cm 2 . The duty cyc...
Embodiment 3
[0036] This embodiment also uses an amorphous silicon thin film on a polycrystalline silicon substrate, and the crystal size of the epitaxial growth that requires a duty cycle close to that will be adjusted by the duty cycle.
[0037] Same as the above-mentioned two embodiments, first place the above-mentioned amorphous silicon thin film figure 1 In a container with protective gas (such as nitrogen) as shown. Apply YAG laser, keep its output power 450w constant, choose laser frequency 15Hz constant, change pulse width, respectively 0.5ms, 1ms, 1.5ms, 2ms, anneal the amorphous silicon film on the polysilicon substrate. After epitaxial growth, the crystal performance of the film was tested by XRD machine, and the diffraction pattern is as follows Figure 4 As shown, it can be seen from the figure that for different pulse widths, the intensity of the XRD diffraction peaks gradually decreases. As the pulse width changes, the duty cycle is 1 / 133, 1 / 66, 1 / 44, 1 / 33 respectively.
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