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Simplified industrial method for recovering cutting fluid from silicon chip cutting and processing mortar

A silicon wafer cutting and cutting fluid technology, applied in the direction of lubricating compositions, etc., can solve the problems of difficult to realize large-scale industrialization of equipment and process methods, and complicated recycling process, so as to achieve the improvement of subsequent recyclable times, simple separation process, and easy operation and controllable effects

Inactive Publication Date: 2010-11-24
JIANGSU JIAYU RESOURCE UTILIZATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the recycling process becomes quite complicated, and it is difficult to achieve large-scale industrialization of equipment, devices and processes

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Using the invention to process silicon wafer cutting mortar, wherein the mass ratio of silicon carbide and polyethylene glycol suspension is 1:1, and the mass ratio of cutting fluid in the mortar is 45%. The cutting fluid used comes from Lianyungang Jiayu Electronic Material Technology Co., Ltd. company. The specific steps are as follows:

[0028] Step 1: Send 1000Kg of mortar that has been pretreated to remove large particles of impurities into a 5000L mixing tank through a delivery pump, start stirring for 10 minutes, add diluent 2000L ethanol within 20 minutes, and measure its viscosity at 16.7cps.

[0029]Step 2: Send the mixture of mortar and diluent that is uniformly stirred above to the precision precision plate and frame filter for primary separation according to the flow rate of 500Kg / h. The filtration precision is 10μm, and the mortar liquid with primary separation is obtained. Collect the filter residue produced by the primary separation as another backup. ...

Embodiment 2

[0033] Using the invention to process silicon wafer cutting mortar, wherein the mass ratio of silicon carbide and polyethylene glycol suspension is 1:1, and the mass ratio of cutting fluid in the mortar is 45%. The cutting fluid used comes from Lianyungang Jiayu Electronic Material Technology Co., Ltd. company. The specific steps are as follows:

[0034] Step 1: Send 1000Kg of the mortar that has been pretreated to remove large particles of impurities into a 5000L mixing tank through a delivery pump, start stirring for 10 minutes, add diluent 1500L acetone within 20 minutes, and measure its viscosity at 17.3cps.

[0035] Step 2, the above-mentioned uniformly stirred mortar and diluent mixture is sent to the laminated precision filter according to the flow rate of 400Kg / h, the filtering form is filter residue collection, and the filtration accuracy of the laminated precision filter is set to 6.5 μm, to obtain Primary separation of mortar liquid. Collect the filter residue pro...

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PUM

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Abstract

The invention relates to a simplified industrial method for recovering cutting fluid from silicon chip cutting and processing mortar. According to the technical scheme, the simplified industrial method for recovering the cutting fluid from the silicon chip cutting and processing mortar comprises the following steps of: firstly, adding a diluting agent into cutting mortar for reducing system viscosity; secondly, carrying out the one-stage separation on the viscosity-reduced mortar by a fine filtering device A to obtain one-stage separated mortar liquid L1; thirdly, carrying out the second-stage separation on the mortar liquid subjected to the one-stage separated by a fine filtering device B and controlling filter fineness to intercept minimum passing gains with grain diameters under 2 micron for further removing solid matters to obtain second-separated mortar liquid L2; and fourthly, ensuring that the second-stage separated mortar liquid L2 passes through an ultrasonic cleaning device and enters a distilling device to remove the diluting agent (recycle) to obtain the recovered cutting liquid.

Description

technical field [0001] The invention relates to a simple industrial method for recovering cutting fluid from silicon wafer cutting mortar. The application field is mainly the resource utilization of silicon wafer cutting and processing mortar in the solar energy industry and silicon wafer cutting and processing mortar in the electronics industry. The cutting fluid products recovered from the mortar can be reused for wire cutting of silicon materials. technical background [0002] Silicon wafers are an important foundation for the development of the solar industry. In the process of silicon wafer processing, cutting silicon rods (ingots) into sheets of a certain thickness by special wire cutting equipment is the current international processing method. With the rapid development of the global solar energy industry, the processing volume and demand of silicon wafers have increased significantly; correspondingly, the mortar produced in the cutting and processing of silicon wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M175/00C10M175/06
Inventor 刘来宝朱志翔孙余凭
Owner JIANGSU JIAYU RESOURCE UTILIZATION
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