Method and device for preparing uniform solidified particles by orifice injection

Abstract

The invention relates to a method and a device for preparing uniform solidified particles by orifice injection, which belong to the technical field of high-melting-point micro-particles and particularly relates to a method for preparing uniform solidified particles by orifice injection. The method comprises the following steps of: smelting a raw material in a crucible with a central hole by using a heater; inputting a pulse signal with a certain waveform to piezoelectric ceramics; driving a piston rod to move downwards and extrude a melt by the piezoelectric ceramics; injecting the melt from an orifice of a bolt with an injection orifice to form liquid drops; and freezing the liquid drops in an annular descending pipe to form the uniform solidified particles. A vacuum furnace and a collecting cabin in the device are fixedly connected with each other through a left bracket and a right bracket; the vacuum furnace is communicated with the middle of the collecting cabin through the annular descending pipe; and the vacuum furnace consists of a furnace body and a furnace door. Various micro-particle materials which have uniform sizes, accordant textures, high sphericity and controllable sizes and meet requirements can be prepared skillfully for materials with different high melting points. The method has the advantages of high efficiency, simple device and energy conservation.

Description

Technical field [0001] The invention belongs to the technical field of preparation of high-melting microparticles, and particularly relates to a method for preparing uniform solidified particles by spraying with small holes. Background technique [0002] With the continuous development of materials in the direction of lightness, miniaturization and integration, uniform spherical particulate materials have received extensive attention and applications in electronic packaging, energy materials, and biomedical materials. Copper spherical particles have good electrical properties, thermal properties, mechanical properties and economic advantages, so they are widely valued and are expected to become the main material in the second-generation electronic packaging technology; solar cells produced by silicon spherical particles can not only reduce traditional silicon wafers The loss of raw materials in the production process can reduce manufacturing costs, and it can also increase the co...

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Problems solved by technology

However, the dispersion of the particles prepared by the atomization method is relatively wide, and the particles that can meet the requirements of use must be obtained through multiple screening and testing; the method of shredding or punching and remelting is not suitable for small particle size particles or materials with poor plastic processing It is more difficult, and the obtained particles must be degreased; the uniform droplet forming method has the problem of unstable precision, especially when the particle size is small; moreover, the above methods are limited to the preparation of low Melting point microparticle materials, there is no significant progress in the research on the preparation of high melting point microparticles

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