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Preparation method of solvent-free and high temperature-resistant adhesive

A high temperature resistant, adhesive technology, applied in the direction of adhesives, adhesive types, aldehyde/ketone condensation polymer adhesives, etc., can solve the problem of low high temperature strength of adhesives, and achieve excellent bonding strength Effect

Inactive Publication Date: 2010-12-22
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the phenolic resin adhesive modified by the existing method is solvent-based, needs to be dried after coating, and the high-temperature strength of the adhesive is low, and provides a method for preparing a solvent-free high-temperature resistant adhesive

Method used

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  • Preparation method of solvent-free and high temperature-resistant adhesive
  • Preparation method of solvent-free and high temperature-resistant adhesive
  • Preparation method of solvent-free and high temperature-resistant adhesive

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specific Embodiment approach 1

[0010] Specific embodiment 1: The preparation method of the solvent-free high-temperature resistant adhesive in this embodiment is as follows: 1. Mix 30-150 g of mixed organosilicon monomer and 10-70 g of water, and then react at 50-100 ° C for 1 h to 5 h. After the mixed solution is in a homogeneous phase, react at 80-130°C for 1h-3h to obtain the product, then add toluene, the amount of toluene added is 1 / 3 of the product mass, and the silicone resin is obtained; 2. Silicone resin, 3-70g of boron compound, 10-100g of phenolic compound, 10-130g of aldehyde and catalyst are reacted at 70-110°C for 1-6 hours, dehydrated to a viscosity of 1-50,000 centipoise, and borosilicate modified 3. Mix 100g of borosilicate modified phenolic resin, 10-120g of filler and 10-100g of polyimide to obtain a solvent-free high temperature resistant adhesive.

specific Embodiment approach 2

[0011] Specific embodiment 2: The difference between this embodiment and specific embodiment 1 is that the mixed organosilicon monomer described in step 1 is dimethyldiethoxysilane, methyltriethoxysilane, methylvinyldi Several of ethoxysilane, vinyltriethoxysilane, diphenyldiethoxysilane, methyltriacetoxysilane, tetraethoxysilane and dodecyltriethoxysilane combination. Others are the same as in the first embodiment.

[0012] When the mixed silicone monomer described in the present embodiment is a composition, the ratio of each component is arbitrary.

specific Embodiment approach 3

[0013] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the boron compound described in step two is one of borax, boric acid, phenylboronic acid and p-bromophenylboronic acid or one of them Several compositions. Others are the same as those in the first or second embodiment.

[0014] When the boron-based compound described in this embodiment is a composition, the ratios between the components are arbitrary.

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Abstract

The invention provides a preparation method of solvent-free and high temperature-resistant adhesive, and relates to a preparation method of adhesive, aiming at solving the problems that the modified phenolic resin adhesive needs to be dried and has low intensity under high temperature since the modified phenolic resin adhesive is solvent type. The method comprises the following steps of: 1. preparing organic silicon; 2. preparing borosilicate-modified phenolic resin; and 3. mixing the borosilicate-modified phenolic resin, the filling material with the polyimide to obtain the solvent-free and high temperature-resistant adhesive. The adhesive does not contain the solvent and is pasty, has good bonding strength and high temperature resistance, has the cutting intensity which is 14.84MPa under the room temperature, has the cutting intensity which is 3.09MPa under the temperature of 700 DEG C, has the cutting intensity which is 1.48MPa under the temperature of 1000 DEG C, and has the residual weight which is high to 74% under the temperature of 1000 DEG C.

Description

technical field [0001] The invention relates to a preparation method of an adhesive. Background technique [0002] High-temperature resistant adhesives are widely used in high-tech fields such as aerospace, electronics, automobiles, and machinery manufacturing. With the rapid development of science and technology, the heat resistance requirements of adhesives in special environments are getting higher and higher. High-temperature-resistant ablation materials or heat-insulating materials cannot be welded or riveted, and can only be bonded. This requires that the adhesive must have sufficient temperature resistance on the one hand, and on the other hand must have a certain strength and cannot If it is too brittle, otherwise it will be easily ablated or the heat insulation material will fall off due to air scour, vibration, and impact of foreign objects during the work process, resulting in major accidents. [0003] Phenolic resin is the earliest artificial synthetic resin. I...

Claims

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Application Information

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IPC IPC(8): C09J161/14C09J179/08
Inventor 张斌孙明明薛刚张绪刚王磊李坚辉李奇力
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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