Polyimide fiber and preparation method thereof

Abstract

The invention relates to a polyimide fiber. The polyimide fiber has a molecular structure general formula shown in the specifications, wherein -Q1- is an aromatic binary primary amine residue without a phenolic hydroxyl group; =Ar= is an aromatic binary anhydride residue; and -Q2- is a phenolic hydroxyl group-containing linker of aromatic binary primary amine. The preparation of the polyimide fiber comprises the following steps of: firstly, stirring the aromatic binary primary amine and aromatic binary anhydride in an organic solvent system at room temperature and reacting for 2 to 4 hours toobtain homogeneous, transparent and viscous polyamic acid solution; secondly, pouring the solution into a spinning machine, performing screw extrusion, forming the fiber by using a spinneret and a coagulating bath, drawing and winding to obtain an as-spun fiber; and finally, treating the as-spun fiber at a high temperature to obtain the polyimide fiber. The polyimide fiber has high resistance to high temperature and high mechanical property; and the preparation process has the advantages of no need of special production equipment, capability of producing on the conventional polyimide resin production line and the spinning machine, easy recycling of an organic solvent, environmental friendliness and suitability for industrial production.

Description

technical field The invention relates to the technical field of organic polymer fiber and its preparation, in particular to a polyimide fiber and its preparation method. Background technique Polyimide is a kind of polymer with excellent comprehensive performance, which has excellent heat resistance, low temperature resistance, solvent resistance, self-lubricating property and flame retardancy. At the same time, it also has very good mechanical properties and Dielectric properties. Therefore, it is widely used in photovoltaic materials, nonlinear optical materials; high temperature resistant materials for spacecraft, satellites or space vehicles; advanced structural composite materials in aerospace, automobiles, electromechanical, etc.; Insulating materials, high temperature resistant adhesives, etc.; and FPC or PCB substrate materials in the field of electronic microelectronics, IC interlayer insulating materials, VLSI passivation coatings and alpha particle barrier coating...

AI Technical Summary

Problems solved by technology

The weak point that this method exists is mainly reflected in the following aspects: (1) the preparation method is only applicable to meltable polyimide systems, and cannot be applied to high-temperature non-melting polyimide powders; (2) The requirements for the extruder are very high, and the extruder must be able to withstand high temperatures above 360°C. Therefore, the extruder needs to be specially designed; (3) The energy consumption is relatively large

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