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Circuit board and method for manufacturing the same

A manufacturing method and circuit board technology, applied in printed circuit manufacturing, multi-layer circuit manufacturing, printed circuit, etc., can solve the problems of reduced accuracy of plating thickness, polluted circuit boards, and insufficient connection reliability, so as to improve connection reliability sexual effect

Inactive Publication Date: 2011-02-02
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, since in this method, the interlayer adhesive between the conductor post and the conductor pad is removed at high temperature during, for example, pressing while the conductor post is melted to achieve electrical connection, variations in the internal temperature of the press may cause The interlayer adhesive cures first, resulting in insufficient connection reliability
In addition, as the system heats up, interlayer adhesive can bleed to the outside of the board, resulting in inaccurate plating thickness or contaminating adjacent boards with outflowing adhesive

Method used

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  • Circuit board and method for manufacturing the same
  • Circuit board and method for manufacturing the same
  • Circuit board and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] First, a two-layer single-sided circuit substrate (two-layersingle-sided circuit substrate) having a thickness of 12 μm of copper foil and a thickness of 25 μm of a polyimide film (Ube Industries, Ltd., SE1310) as a base material was prepared, And a via with a diameter of 50 μm was formed from the side opposite to the copper foil by a UV laser. After plasma desmearing, copper electroplating and lead-free solder plating were performed to form copper protrusions protruding 8 μm from the substrate, which were then metallized again by lead-free solder plating to a thickness of 15 μm, thereby forming a conductor column. Subsequently, a circuit board is formed by etching, thereby producing a first substrate. Then, a two-layer double-sided circuit substrate having a copper foil having a thickness of 12 μm and a polyimide film (Mitsui Chemicals Inc., NFX-2ABEPFE (25T)) having a thickness of 25 μm as a base material was etched to form a circuit plate, thereby obtaining a secon...

Embodiment 2

[0091] The procedure described in Example 1 was also carried out except that the interlayer adhesive in Example 1 was replaced with the following interlayer adhesive. In order to prepare the interlayer adhesive, weigh 40 parts by weight of naphthalene skeleton type tetrafunctional epoxy resin (Dainippon Ink And Chemicals, Incorporated., Development No.EXA-4700; epoxy equivalent weight: 162) in a container, 30 parts by weight 30 parts by weight of dicyclopentadiene type epoxy resin (DainipponInk And Chemicals, Incorporated, HP-7200; epoxy equivalent: 258), 30 parts by weight of novolac type phenolic resin (Sumitomo Bakelite Co., Ltd. PR-53647) and 100 parts by weight of acetone, stirring the mixture to dissolve, and adding 3 parts by weight of p-toluic acid (Kanto Chemical Co., Inc. reagent grade; boiling point: 275°C), and the mixture was stirred to dissolve, thereby producing a varnish. The varnish with a thickness of 13 μm after drying was coated on an antistatic-treated PE...

Embodiment 3

[0094] The method as described in Example 1 was carried out, except that the first step in Example 1 was carried out by a vacuum press at 180°C and 2MPa, the joining step was carried out in a reflux system at 260°C for 3 minutes, and the following layers were used between adhesives.

[0095]The glycidylamine type trifunctional epoxy resin (JER Company, Epicoat 630; epoxy equivalent weight: 100) of weighing 20 weight parts in container, the dicyclopentadiene type epoxy resin (DainipponInk And Chemicals, DainipponInk And Chemicals, 40 weight parts) Incorporated, HP-7200; Epoxy equivalent: 258), 40 parts by weight of novolac type phenolic resin (Sumitomo Bakelite Co., Ltd.PR-53647) and 100 parts by weight of acetone, stirring the mixture to dissolve, and to 15 parts by weight of 4-biphenylcarboxylic acid (Kanto Chemical Co., Inc., reagent grade; boiling point: 225° C. or higher) having a melting point of 225° C. was added to 100 parts by weight of the resin composition, and the m...

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Abstract

Provided are a circuit board, which has little outflow of an interlayer adhesive to be used for a multilayer lamination while keeping a connection reliability, and a method for manufacturing the circuit board. The circuit board (68) is characterized in that a first substrate (16) including a first base (12) and a conductor post (45) composed of a protruding portion (14) protruding from the first base (12) and a metallic cover layer (15) covering the protruding portion (14), and a second substrate (18) including a second base (19) and a conductor circuit (17) are laminated and adhered through an interlayer adhesive (13) and are alloyed at a junction face (43) between the metallic cover layer (15) and the conductor circuit (17), and in that the section, as viewed in the section of the junction face (43), of the metallic cover layer (15) is shaped to become wider from the junction face (43) of the conductor circuit (17) toward the first substrate (16).

Description

technical field [0001] The present invention relates to a circuit board and a method of manufacturing the same. Background technique [0002] In recent years, electronic equipment integrated at a higher density has accelerated the multilayering of circuit boards such as flexible printed circuit boards used in this equipment. A build-up method is a technique for forming such a multilayer circuit board by lamination. The build-up method refers to a method of forming an interlayer connection between single layers and simultaneously stacking a resin layer and a conductor layer composed of resin alone. [0003] This build-up method is generally classified into a method of forming a via hole in a resin layer before forming an interlayer connection and a method of forming an interlayer connection before laminating the resin layers. In addition, different types of interlayer connections are used depending on, for example, whether via holes are formed by plating or conductive paste...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K2201/0133H05K3/386H05K1/0393H05K3/4617H05K2201/09827H05K3/4635Y10T29/49126
Inventor 近藤正芳小宫谷寿郎
Owner SUMITOMO BAKELITE CO LTD