Preparation method of OLED panel polycrystalline silicon
A production method and technology of polysilicon, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as deterioration of TFT characteristics
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[0041] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0042] To make complete as figure 1 The AMOLED structure shown requires the following steps in sequence:
[0043] (1) After the glass substrate 1 is cleaned, a silicon oxide (SiOx) buffer layer 2 is deposited thereon by plasma enhanced chemical vapor deposition (PECVD).
[0044] (2) Deposit 500 angstroms of amorphous silicon on the glass substrate 1 by low-pressure chemical vapor deposition (LPCVD) to form an amorphous silicon layer 41; the thickness of the amorphous silicon can be adjusted as required.
[0045] (3) Clean the glass substrate before photolithography, and evenly coat the photoresist layer 42 on the amorphous silicon layer 41. The thickness of the photoresist is 1.2 microns, forming such as figure 2 For the structure shown, the thickness of the photoresist can be adjusted as needed.
[0046] (4) photoresist is exposed and deve...
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