Trench MOSFET

A technology of trenches and trench gates, which is applied to electrical components, transistors, circuits, etc., can solve the problems of degraded avalanche breakdown characteristics of devices, reduce injection efficiency, improve avalanche breakdown characteristics, and reduce area Effect
CN101989602AActive Publication Date: 2011-03-23FORCE MOS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
FORCE MOS TECH CO LTD
Publication Date
2011-03-23

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Abstract

The invention discloses a trench metal-oxide-semiconductor field effect transistor (MOSFET) structure and a manufacturing method thereof. Different from a source area of a trench MOSFET formed by a method in the prior art, the source area of the structure is formed by ion implantation and diffusion of majority carriers in the source area at the opening of a source body contact trench, so that the concentration distribution of the majority carriers of the source area is Gaussian distribution from the source body contact trench to a channel area along the surface of an epitaxial layer, and the junction depth of the source area is gradually reduced from the source body contact trench to the channel area. A trench MOSFET device with the structure has better avalanche breakdown property compared with the prior art. Correspondingly, in the manufacturing process, the invention discloses a manufacturing method only needing a mask plate for three times, and the production cost is greatly reduced.
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Description

technical field

[0001] The invention relates to a unit structure of a semiconductor power device, a device structure and a process manufacturing method. In particular, it relates to a trench MOSFET (Metal Oxide Semiconductor Field Effect Transistor) structure with improved avalanche breakdown characteristics and its manufacturing method using a three-layer mask. Background technique

[0002] US Patent Publication No. US.6,888,196 discloses a trench MOSFET structure and manufacturing method, such as Figure 1A shown. The structure of the trench MOSFET includes: a substrate 100 of N+ conductivity type; an epitaxial layer 102 of N conductivity type; a plurality of trench gates 105; a body region 103 of P conductivity type and a source region 104 of N+ conductivity type. Wherein, the source region 104 is defined by the source region mask, and formed by ion implantation and subsequent diffusion, such as Figure 1B shown. Therefore, the source region 104 has the same doping con...

Claims

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