Composite additive for producing electrolytic copper foil with high bending resistance and low outline

Abstract

The invention relates to a composite additive for producing an electrolytic copper foil with high bending resistance and a low outline, which belongs to the technical field of the production process of highly precise electrolytic copper foils. The composite additive for producing the electrolytic copper foil with the high bending resistance and the low outline is characterized by consisting of cellulose, glutin, thiazoline based sodium dithiopropanesulphonate and succinic acid ester sulfonate. The additive and the formula adopted by the invention have the advantages that: the tensile strength and elongation of a product at normal temperature and high temperature is improved, and the defect of low bending resistance of the electrolytic copper foil is effectively overcome; and the surface roughness of the electrolytic copper foil for high peak valve is more than or equal to 3 mu m, the transmission distance of a signal in a flexible printed circuit (FPC) is extended, attenuation and delay can be generated, so a high-frequency signal cannot be transmitted at a high speed, but the additive and the formula adopted by the invention ensure that the product has low outline property, has the rough surface roughness of less than or equal to 1.5mu m, can meet the using requirement of the FPC on a precise circuit and high-frequency high-speed transmission, and has a simple production process and lower cost.

Description

technical field [0001] The invention relates to a composite additive and belongs to the technical field of high-precision electrolytic copper foil production technology. Background technique [0002] Electrolytic copper foil is an important raw material for the manufacture of copper clad laminates (CCL) and printed circuit boards (PCB). With the rapid development of the information society, industries such as electronics, information and 3G communications tend to be "miniaturized, precise, ultra-thin, and portable". Light, thin and short, successively changed from rigid circuit boards to flexible circuit boards. [0003] Flexible Printed Circuit (FPC), English abbreviation FPC, commonly known as soft board, has the advantages of being light, thin, free to bend, wind, and can move and stretch freely in three-dimensional space, and has been widely used in MP3 and MP4 playback Devices, portable CD players, home DVD, digital cameras, mobile phones and mobile phone batteries, m...

AI Technical Summary

Problems solved by technology

Rolled copper foil has a sheet-like crystal structure with high density, so it has excellent properties such as elongation, bending resistance, high temperature recrystallization, and uniform surface smoothness. This is why FPC manufacturers only used rolled copper foil in the past. , but the processing technology of rolled copper foil is complicated and the cost is high, so that electrolytic copper foil for FPC with the same special performance and favorable price is more and more used in FPC instead of rolled copper foil, because FPC is light, thin, and can be bent freely , winding and other advantages, which requires the electrolytic copper foil used must have stable physical and chemical properties, especially the low profile and bending resistance of electrolytic copper foil

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