Semiconductor wafer grinding force on-line measurement device and force-controlling grinding method

Abstract

The invention belongs to the ultraprecision machining field of the hard and brittle semiconductor crystalline materials and relates to a grinding force on-line measurement device used in the grinding process of the semiconductor wafer and a force-controlling grinding method. The invention discloses a semiconductor wafer grinding force on-line measurement device which is used as the feedback element of a grinding force adaptive control system. The grinding force measurement device adopts the piezoelectric measuring principle and contains a sensor part and a data processing unit, wherein the sensor part is used for the on-line measurement of the radial force Fr, the tangential force Ft and the axial force Fz; and the data processing unit is used to collect and analyze the grinding force data and perform feedback control to the feed speed and feed amount of the grinding wheel, thus the aim of on-line measurement can be achieved. The invention has the following advantages: the grinding force on-line measurement device has simple structure, and the modifications to the original equipment are less; the grinding force on-line measurement links are fewer, the response speed is fast, and the precision is high; and the grinding efficiency of the semiconductor wafer can be increased and the thickness of the damaged layer is reduced.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision processing of hard and brittle semiconductor wafers, and relates to a semiconductor wafer grinding force measuring device and a control force grinding method for measuring three-way grinding force in real time and using the value as a control grinding wheel feed. Background technique [0002] Semiconductor wafers are currently an important substrate material in the manufacture of integrated circuits (ICs). In the IC chip manufacturing process, ultra-precision grinding technology is mainly used for planarization processing in wafer preparation and wafer back thinning processing in subsequent processes. With the continuous development of integrated circuit chips in the direction of high integration, high density and high performance, while the diameter and original thickness of semiconductor wafers continue to increase, the final thickness of the required wafers continues to decrease. Therefo...

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Problems solved by technology

[0006] The invention aims at the contradiction between processing efficiency and surface quality in the ultra-precision grinding process of semiconductor wafers and the problem of how to obtain high-precision wafer surfaces, combining the structural characteristics of the developed wafer grinder and the interaction between the grinding wheel and the wafer in the grinding process According to the distribution of force, a piezoelectric grinding force online measuring device is proposed to monitor the three-way grinding force dynamically in real time, and the wafer grinding method and implementation device are used to control the feed speed and feed rate through the feedback of the measured value. For efficient grinding and constant force grinding of semiconductor wafers

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