Preparation method of ceramic-glass polishing solution
A technology of glass-ceramic and polishing liquid, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc. It can solve the problems of difficult cleaning of residual particles, poor fluidity of polishing slurry, pollution cleaning, etc., and achieve high speed, high smoothness and low Damage polishing, remarkable application effect, and the effect of improving yield
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Embodiment 1
[0027] Embodiment 1: prepare 5000g glass-ceramic polishing liquid
[0028] Abrasive alkaline nano-SiO 2 The hydrosol forms a vortex under negative pressure and sucks it into a negative pressure reactor; while stirring, it sucks SiO with a particle size of 15-25nm 2 Sol 1300g, the abrasive weight concentration is SiO of 40wt%, dispersion degree2 Sol, using negative pressure to automatically inhale silica sol, which can avoid the introduction of pollutants during the feeding process; inhale 3400g deionized water while stirring; then inhale 200g amine base, 50gFA / OII active agent and 50gFA / OII respectively under negative pressure stirring OII type chelating agent is mixed with the above liquid; the amine base is arbitrarily selected from one or more of triethanolamine, tetraethylammonium hydroxide, ethylenediamine, hydroxyethylethylenediamine or polyethylene polyamine; the amine base adjusts the pH If the value is 9-13, add an amine base pH regulator under the negative pressure ...
Embodiment 2
[0032] Prepare 10000g glass-ceramic polishing liquid
[0033] Abrasive alkaline nano-SiO 2 Under negative pressure, the hydrosol forms a vortex and sucks into the negative pressure reactor; while stirring, it sucks SiO with a particle size of 20-40nm 2 Sol 9000g, this abrasive weight concentration is the SiO of 45wt%, degree of dispersion2 Silica sol, using negative pressure to automatically inhale silica sol, which can avoid the introduction of pollutants during the feeding process; inhale 700g deionized water while stirring; then inhale 250g amine base, 25gFA / OII active agent and 25gFA / OII respectively under negative pressure stirring OII type chelating agent is mixed with the above liquid; the amine base is more than one of triethanolamine, tetraethylammonium hydroxide, ethylenediamine, hydroxyethylethylenediamine or polyethylene polyamine; the amine base adjusts the pH value 9-13, add an amine base pH regulator under the state of negative pressure vortex to prevent the lo...
Embodiment 3
[0036] Prepare 18000g glass-ceramic polishing liquid
[0037] Abrasive alkaline nano-SiO 2 Under negative pressure, the hydrosol forms a vortex and sucks into the negative pressure reactor; while stirring, it sucks SiO with a particle size of 30-45nm 2 Sol 12000g, the abrasive weight concentration is 25wt% SiO with dispersion2 Silica sol, using negative pressure to automatically inhale silica sol, which can avoid the introduction of pollutants during the feeding process; inhale 5500g deionized water while stirring; then inhale 350g amine base, 70gFA / OII active agent and 80gFA / OII respectively under negative pressure stirring OII type chelating agent is mixed with the above liquid; the amine base is more than one of triethanolamine, tetraethylammonium hydroxide, ethylenediamine, hydroxyethylethylenediamine or polyethylene polyamine; the amine base adjusts the pH value 9-13, add an amine base pH regulator under the state of negative pressure vortex to prevent the local pH from ...
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