Liquid epoxy encapsulating material and preparation method thereof

A technology of epoxy encapsulation and loading, which is applied in epoxy resin glue, semiconductor/solid-state device parts, adhesive types, etc. The effect of high speed, good thermal conductivity and high bond strength

Inactive Publication Date: 2011-04-27
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the traditional epoxy encapsulant (solid state) is widely used as a semiconductor encapsulation material in the market, but since 1990, with the miniaturization of sem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Weigh epoxy resin 1: bake epoxy resin 828EL (shell) 22.5g overnight at 70°C, alicyclic epoxy resin 2021P (produced by Dainippon Ink) 37.0g, black paste 0.5g (Degussa T4 black pigment and 828EL are mixed in proportion, the specific ratio is 2: 8), mixed at 20 ℃ for 20 minutes, then add 88 grams of spherical filler silica spherical filler (specifically Toyota Tsusho FED45B) in parts by weight, oxidized 90g of aluminum spherical filler, 4.8g of dicyandiamide curing agent, 0.5g of curing accelerator PN-H (produced in Japan Ajinomoto) and 2.0g of coupling agent KH560, placed in a three-roll machine for curing and mixing, repeated Mix three times, mix well and add to the reaction kettle under full vacuum for 90 minutes.

[0033] Using DSC test, the curing temperature is 120°C for 15 minutes. According to the GB / T7124-1986 standard, the shear strength is 13MPa; the CTE (linear expansion coefficient) a1 is 20ppm, the Tg point is 157°C, and the thermal conductivity is 3.2w. / m....

Embodiment 2

[0035] Weigh epoxy resin 1: bake 20g of epoxy resin 828EL (shell) overnight at 75°C, 35g of alicyclic epoxy resin 2021P (produced by Dainippon Ink), 0.5g of black paste (Degussa T4 black Pigment and 828EL were mixed in proportion, the specific ratio was 2:8), and mixed for 40 minutes at 30°C, and then 80 grams of spherical filler silica spherical filler (specifically Toyota Tsusho FED45B) and alumina balls were added in parts by weight. Type filler 80g, dicyandiamide curing agent 4g, curing accelerator PN-H (produced in Japan Ajinomoto) 0.5g and coupling agent KH570: 1g, put it into a three-roll machine for curing and mixing, repeat the mixing three times, After mixing evenly, add to the reaction kettle and maintain full vacuum for 90 minutes.

[0036] Using DSC test, the curing temperature is 120°C for 15 minutes, according to the GB / T7124-1986 standard, the shear strength is 13MPa; the CTE (linear expansion coefficient) a1 is 25ppm, the Tg point is 157°C, and the thermal con...

Embodiment 3

[0038] Weigh epoxy resin 1: bake epoxy resin 828EL (shell) 22.5g overnight at 72°C, alicyclic epoxy resin 2021P (produced by Dainippon Ink) 37.5g, black paste 0.5g (Degussa T4 black pigment is mixed with 828EL in proportion, the specific ratio is 2: 8), mixed at 25 ℃ for 30 minutes, then add 95 grams of spherical filler silica spherical filler (specifically Toyota Tsusho FED45B) in parts by weight, oxidized 95g of aluminum spherical filler, 5g of dicyandiamide curing agent, 1.25g of curing accelerator PN-H (produced in Japan Ajinomoto) and 2g of coupling agent KH550, placed in a three-roll machine for curing and mixing, and repeated mixing for three times. After mixing evenly, add it to the reaction kettle and keep it under full vacuum for 90 minutes.

[0039] Using DSC test, the curing temperature is 120°C for 15 minutes, according to the GB / T7124-1986 standard, the shear strength is 13MPa; the CTE (linear expansion coefficient) a1 is 22ppm, the Tg point is 157°C, and the the...

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Abstract

The invention relates to a liquid epoxy encapsulating material and a preparation method thereof. The liquid epoxy encapsulating material consists of the following raw materials in part by weight: 20 to 25 parts of epoxy resin, 35 to 40 parts of alicyclic epoxy resin, 0.5 part of pigment, 160 to 220 parts of spherical filler, 4 to 6 parts of curing agent, 0.5 to 2 parts of accelerator and 1 to 3 parts of coupling agent. The preparation method of the liquid epoxy encapsulating material comprises the following steps of: roasting the epoxy resin at the temperature of between 70 and 75 DEG C overnight; mixing 20 to 25 weight parts of roasted epoxy resin, 35 to 40 weight parts of alicyclic epoxy resin and 0.5 weight part of pigment at the temperature of between 20 and 30 DEG C for 20 to 40 minutes; adding 160 to 220 weight parts of spherical filler, 4 to 6 weight parts of curing agent, 0.5 to 2 weight parts of accelerator and 1 to 3 weight parts of coupling agent into the mixture; placing the mixture into a three-roll machine to cure and mix; mixing for three times repeatedly; and after the materials are mixed uniformly, adding the mixture into a reaction kettle to keep the filled vacuum for 90 minutes.

Description

technical field [0001] The invention relates to a liquid epoxy encapsulation material and a preparation method thereof, which has good formability and heat resistance, good mechanical strength and electrical insulation, small thermal expansion coefficient, small water vapor permeability, and does not contain harmful substances to components. Affected impurities. Background technique [0002] The semiconductor packaging industry occupies the dominant position in the domestic integrated circuit industry, and how to choose electronic packaging materials is even more important. According to data, more than 90% of transistors and 70%-80% of integrated circuits have used plastic packaging materials, and epoxy molding compound is the most common packaging material. Semiconductor packaging enables such as diodes, transistors, ICs, etc. to maintain their own airtightness, protect them from the influence of humidity and temperature in the surrounding environment, and prevent electron...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J11/04C09J11/06H01L23/29
Inventor 周建忠王建斌陈田安
Owner YANTAI DARBOND TECH
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