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Laminate, metal-foil-clad laminate, circuit board, and circuit board for LED mounting

A laminate and base material technology, which is applied in the direction of circuit substrate materials, metal layered products, printed circuit components, etc., can solve problems such as insufficient heat dissipation of laminates

Active Publication Date: 2011-04-27
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional laminates have a problem of insufficient heat dissipation as substrates used in such applications

Method used

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  • Laminate, metal-foil-clad laminate, circuit board, and circuit board for LED mounting
  • Laminate, metal-foil-clad laminate, circuit board, and circuit board for LED mounting
  • Laminate, metal-foil-clad laminate, circuit board, and circuit board for LED mounting

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066]

[0067] A gibbsite type aluminum hydroxide (Sumitomo Chemical ( Co., Ltd., D 50 : 5.4 μm) 35 parts by volume, gibbsite-type aluminum hydroxide (manufactured by Sumitomo Chemical Co., Ltd., D 50 : 12.6μm) 35 parts by volume, boehmite (D 50 : 5.5 μm) 15 parts by volume, and alumina (manufactured by Sumitomo Chemical Co., Ltd., D 50 : 0.76μ) 15 parts by volume to make them uniformly dispersed. Make the weight per unit area 60g / m 2 A glass nonwoven fabric (made by Baoling Co., Ltd.) with a thickness of 400 μm was impregnated with a resin varnish blended with a filler to obtain a core layer prepreg.

[0068] On the other hand, by making the weight per unit area 200g / m 2 A glass cloth (woven fabric) (7628 manufactured by Nittobo Co., Ltd.) having a thickness of 180 μm was impregnated with an epoxy resin varnish containing a hardener not mixed with a filler to obtain a surface layer prepreg.

[0069] Then, two core material layer prepregs were stacked, and one surface...

Embodiment 2～7、 and comparative example 1～14

[0084] In the manufacture of the core material layer prepreg, except having changed the composition of the resin composition as shown in Table 1 or Table 2, it carried out similarly to Example 1, and obtained the laminated body, and evaluated it. Table 1 shows the results of Example 1 and Examples 2-7, and Table 2 shows the results of Comparative Examples 1-14.

[0085] In addition, in Example 4 and Example 6, the average particle diameter (D 50 ) talc (manufactured by Fuji Talc Industry Co., Ltd.)) of 6.5 μm, the average particle diameter (D 50 ) 0.76 μm alumina (manufactured by Sumitomo Chemical Co., Ltd.).

[0086]

[0087]

[0088] According to the results shown in Table 1 and Table 2, the copper-clad composite laminates of Examples 1 to 7 of the present invention all have high thermal conductivity above 0.97 W / m K, heat resistance, drill wear resistance, resistance The flammability is relatively high. On the other hand, compared with the copper-clad composite lam...

Embodiment 8～16、 and comparative example 15～27

[0090] In the manufacture of the core material layer prepreg, except having changed the composition of the resin composition like Table 3 or Table 4, it carried out similarly to Example 1, and obtained the laminated body, and evaluated it. Table 3 shows the results of Examples 8-16, and Table 4 shows the results of Comparative Examples 15-27.

[0091] In addition, in Example 14, the average particle diameter (D 50 ) 6.5 μm of crystalline silica, in Example 15 using the average particle size (D 50 ) magnesia of 6.5 μm (manufactured by Nippon Light Metal Co., Ltd.), the average particle diameter (D 50 ) Aluminum nitride (manufactured by Furukawa Electronics Co., Ltd.) of 6.6 μm, the average particle diameter (D 50 ) 4 μm alumina (manufactured by Sumitomo Chemical Co., Ltd.).

[0092]

[0093]

[0094] According to the results in Table 3, the thermal conductivity of the laminates of Examples 8 to 16 of the present invention are all high, and the oven heat resistance and ...

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Abstract

A laminate which comprises: a core material layer obtained by impregnating a nonwoven fibrous base with a thermosetting resin composition; and surface material layers respectively laminated to both surfaces of the core material layer. The thermosetting resin composition comprises 100 parts by volume of a thermosetting resin and 80-150 parts by volume of an inorganic filler. The inorganic filler comprises (A) gibbsite-form aluminum hydroxide particles having an average particle diameter (D50) of 2-15 [mu]m, (B) at least one inorganic ingredient selected from a group consisting of boehmite particles having an average particle diameter (D50) of 2-15 [mu]m and inorganic particles which have an average particle diameter (D50) of 2-15 [mu]m and which contain crystal water having a release initiation temperature of 400 DEG C or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.5 [mu]m or smaller, the proportion of (A) the gibbsite-form aluminum hydroxide particles to (B) the at least one inorganic ingredient selected from a group consisting of the boehmite particles and the inorganic particles to (C) the aluminum oxide particles (ratio by volume) being 1:(0.1-1):(0.1-1).

Description

technical field [0001] The present invention relates to a laminate used in the field of circuit boards for various electronic devices, especially a laminate excellent in heat dissipation, and a metal foil-clad laminate manufactured using the laminate, a circuit board, and an LED mounting circuit substrate. Background technique [0002] As a representative laminated board used in printed circuit boards for electronic equipment, it is widely used to laminate a prepreg (prepreg) obtained by impregnating glass cloth with a resin component such as epoxy resin. Laminates of the FR-4 type. In addition, the name FR-4 is a classification based on the specifications of NEMA (National Electrical Manufacturers Association) in the United States. This FR-4 type laminate has a disadvantage of poor press workability and drill workability. As a printed circuit wiring board that can solve such shortcomings, there is known a composite laminated board called CEM-3, which uses a non-woven fab...

Claims

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Application Information

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IPC IPC(8): B32B27/18B32B5/28B32B15/08B32B27/20H05K1/03
Inventor 铃江隆之野末明义
Owner PANASONIC CORP
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