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Halogen-free flame-retardant epoxy resin composition and application thereof

A technology of epoxy resin and epoxy resin solution, applied in the direction of printed circuit parts, etc., can solve the problems of unstable product quality, inability to use in large quantities, and expensive products, and achieve good reactivity, good flame retardancy, and peeling. high intensity effect

Active Publication Date: 2011-05-11
EPOXY BASE ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are very few domestic manufacturers that can produce halogen-free flame-retardant epoxy resins. Even if they can produce halogen-free flame-retardant epoxy resins, the quality of their products is unstable and difficult to use; and halogen-free flame-retardant epoxy resin products with slightly better performance All are imported products, so that the products are expensive and cannot be used in large quantities
In addition, the current halogen-free flame retardant resins are hard and brittle, have high water absorption, poor bonding performance (especially in land pull thermal drawing) and insufficient heat resistance (mainly manifested in T 288 Heat resistance) and other defects

Method used

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  • Halogen-free flame-retardant epoxy resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] (1) Preparation of phosphorus-containing epoxy resin butanone solution:

[0035] Add 41 parts by weight of novolac epoxy resin and 17 parts by weight of DOPO into the reaction tank, add 0.010 parts by weight of catalyst triphenylphosphine at 120 ° C, react at 175 ° C for 2.5 hours, and then mix in 15 parts by weight of epoxy equivalent Greater than the large molecular weight solid bisphenol A type epoxy resin of 450g / eq, the o-cresol type epoxy resin of 23 weight parts and the solid content of 5 weight parts are the tetraphenol ethane tetraglycidyl ether acetone solution of 70%, and then Dissolve it with methyl ethyl ketone to form a solution with a solid content of 70%.

[0036] (2) Preparation of halogen-free flame retardant epoxy resin composition:

[0037] Take by weighing the phosphorus-containing epoxy resin methyl ethyl ketone solution and dicyandiamide curing agent obtained in step (1) as shown in the table below, and add curing accelerator, inorganic filler an...

Embodiment 2

[0043] (1) Preparation of phosphorus-containing epoxy resin butanone solution:

[0044] Add 45 parts by weight of novolac epoxy resin and 18 parts by weight of DOPO to the reaction tank, add 0.010 parts by weight of catalyst triphenylphosphine at 120 ° C, react at 175 ° C for 2.5 hours, and then mix in 17 parts by weight of epoxy equivalent Greater than the large molecular weight solid bisphenol A type epoxy resin of 450g / eq, the o-cresol type epoxy resin of 26 weight parts and the solid content of 7 weight parts are the tetraphenol ethane tetraglycidyl ether acetone solution of 70%, and then Dissolve it with methyl ethyl ketone to form a solution with a solid content of 70%.

[0045] (2) Preparation of halogen-free flame retardant epoxy resin composition:

[0046] Take by weighing the phosphorus-containing epoxy resin methyl ethyl ketone solution and dicyandiamide curing agent obtained in step (1) as shown in the table below, and add curing accelerator, inorganic filler and ...

Embodiment 3

[0051] (1) Preparation of phosphorus-containing epoxy resin butanone solution:

[0052] Add 35 parts by weight of novolac epoxy resin and 15 parts by weight of DOPO into the reaction tank, add 0.020 parts by weight of catalyst triphenylphosphine at 120°C, react at 175°C for 2.5h, and then mix in 15 parts by weight of epoxy equivalent Greater than the large molecular weight solid bisphenol A type epoxy resin of 450g / eq, the o-cresol type epoxy resin of 22 weight parts and the tetraphenol ethane tetraglycidyl ether acetone solution of 70% solid content of 5.3 weight parts, use again Butanone dissolves to a 70% solids solution.

[0053] (2) Preparation of halogen-free flame retardant epoxy resin composition:

[0054] Take by weighing the phosphorus-containing epoxy resin methyl ethyl ketone solution and dicyandiamide curing agent obtained in step (1) as shown in the table below, and add curing accelerator, inorganic filler and an appropriate amount of solvent, and mix uniformly:...

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Abstract

The invention belongs to the technical field of epoxy resin preparation and discloses a halogen-free flame-retardant epoxy resin composition. The halogen-free flame-retardant epoxy resin composition comprises the following components in parts by weight: 130-160 parts by weight of phosphor-containing epoxy resin solution, 2.80-3.10 parts by weight of dicyandiamide curing agent, 0.05-0.15 part by weight of curing accelerator, 20-100 parts by weight of filler and 85-150 parts by weight of solvent. The halogen-free flame-retardant epoxy resin composition disclosed by the invention has the advantages of favorable operability, strong binding property, favorable flame-retardant performance, excellent reactivity and the like and is used for preparing a printed circuit copper clad laminate, so that the copper clad laminate has the comprehensive performances of favorable toughness, high stripping strength, favorable heat resistance (T288 reaches over 10 minutes) and the like.

Description

technical field [0001] The invention belongs to the technical field of epoxy resin preparation, and in particular relates to a halogen-free flame-retardant epoxy resin composition and its application in preparing printed circuit copper-clad boards. Background technique [0002] At the beginning of 2003, the European Union announced the "two directives" (RoHS, WEEE) on the environmental protection of electrical and electronic products. According to the directive, since July 1, 2006, the use of six harmful substances including polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) has been completely banned in the production of electronic products. [0003] In the past 30 years, a large number of chemical materials such as tetrabromobisphenol A and brominated epoxy resin have been used in the main substrate material of printed circuit boards - copper clad laminates, in order to make copper clad laminates meet the requirements for flame retardancy. Over the y...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/04C08L63/02C08K3/36C08K3/22C08G59/14C08G59/50H05K1/02
Inventor 黄活阳林仁宗吴永光
Owner EPOXY BASE ELECTRONICS MATERIAL
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