Hot water resistant polyamide thin layer and manufacturing method thereof

A polyamide film, hot water resistance technology, applied in chemical instruments and methods, polyurea/polyurethane coatings, synthetic resin layered products, etc., can solve the problem of insufficient adhesion between nylon film and ink, adhesives, peeling, etc. Problems, achieve excellent adhesion, excellent hot water resistance, and industrially beneficial effects

Inactive Publication Date: 2011-05-25
UNITIKA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, nylon film has insufficient adhesion to inks and adhes

Method used

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  • Hot water resistant polyamide thin layer and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] The polyurethane latex manufactured by DIC ADS-120" (solid content concentration 50% by mass) was diluted with ion-exchanged water to produce a water-based primer paint with a resin solid content of 10% by mass.

[0082] And used the following composition, that is, with respect to nylon 6 (relative viscosity 3.0 (25 ℃, 95 mass% sulfuric acid)) 99.80% by mass, as a hindered phenolic compound belonging to the antioxidant tetra[3-(3 , 5-di-tert-butyl-4-hydroxyphenyl) propionic acid] pentaerythritol ester (hereinafter referred to as "antioxidant A") is 0.05% by mass, and ethylene bisstearic acid amide as an organic lubricant is 0.15 The composition obtained by blending in mass %. The composition was mixed and melted at 240°C, and then extruded into a sheet with a T die, then it was adhered to a rotating drum at 25°C and quenched to obtain an unstretched substrate with a thickness of 150μm. film.

[0083] Next, the above-mentioned water-based paint was applied on the unstretch...

Embodiment 2

[0086] Compared with Example 1, the content of antioxidant A was changed to 0.10% by mass. Otherwise, the same operation as in Example 1 was performed to obtain a biaxially oriented polyamide film. The evaluation results of the obtained polyamide film are shown in Table 1.

Embodiment 3

[0088] Compared with Example 1, the polyurethane resin used was changed to "NeoRez R9679" (solid content concentration 37% by mass) manufactured by DSM Corporation, and it was diluted with ion exchange water to a solid content concentration of 10% by mass, and used as an aqueous paint. Otherwise, the same operations as in Example 1 were carried out to obtain a biaxially stretched polyamide film. The evaluation results of the obtained polyamide film are shown in Table 1.

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Abstract

A hot water resistant polyamide thin layer. An undercoating layer containing polyurethane resin with a film extensional proportion of above 250% and a tensile strength of above 20 MPa is formed on at least one side of a polyamide substrate thin layer containing 0.01-0.2 wt% of hindered phenolic compounds.

Description

Technical field [0001] The present invention relates to a heat-resistant water-resistant polyamide film and a method for manufacturing the same. Background technique [0002] For a long time, biaxially oriented polyamide film not only has basic physical properties represented by mechanical properties, optical properties, thermal properties, and barrier properties, but also has excellent wear resistance, impact resistance, crack resistance, etc., so it is used as food And other packaging materials are widely used. [0003] In these applications, generally, various secondary processes are performed on the surface of the substrate film, such as coating of various paints, printing processes, vapor deposition processes, and lamination processes with other films. In particular, when the polyamide film is used for food packaging, the sealing film is laminated with an adhesive after the printing process. However, if the adhesive force at this time is weak, there is a problem of peeling b...

Claims

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Application Information

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IPC IPC(8): B32B27/08C08L77/02C08K5/134C08K5/20C09D175/04
Inventor 汤存福大葛贵良田中信广
Owner UNITIKA LTD
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