Method for preparing germanium quantum dot doped nano-titanium dioxide composite film
A nano-titanium dioxide, composite film technology, applied in ion implantation plating, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of easy agglomeration of quantum dots, low production efficiency, low film compactness, etc. the effect of reunion
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example 1
[0014] The equipment used in the implementation process of the present invention is the IBAD-600 multifunctional ion implantation and ion beam sputtering system.
[0015] Soak a 2cm×2cm square quartz substrate in acetone solution for 15 minutes, then ultrasonically clean it with absolute ethanol for 10 minutes, and finally wash it with a large amount of deionized water; 99.99% germanium target surface wipe clean. Then fix the cleaned quartz substrate and titanium dioxide and germanium targets on the substrate and target positions in the sputtering vacuum chamber respectively, and vacuumize to make the background vacuum degree reach 8×10 -4 Pa, and then pass into the sputtering chamber argon gas with a purity of 99.99%, so that the pressure in the sputtering chamber is 2.0×10 -2 Pa, adjust the temperature in the sputtering chamber to 25°C. Before sputtering the film, the target and the substrate were pre-sputtered and cleaned for 5-10 minutes by using an argon ion beam with a...
example 2
[0017] The cleaning process of the required quartz substrate and target material during the preparation of the nanocomposite film is the same as in Example 1.
[0018] Fix the cleaned quartz substrate and target on the substrate and target in the sputtering vacuum chamber respectively, and evacuate to make the background vacuum degree reach 6.0×10 -4 Pa, and then pass into the sputtering chamber argon gas with a purity of 99.99%, so that the pressure in the sputtering chamber is 2.5×10 -2 Pa, adjust the temperature in the sputtering chamber to 100°C. The pre-sputtering cleaning process of the quartz substrate and target is the same as in Example 1. Firstly, an argon ion beam with an extraction current of 20 mA and an extraction voltage of 0.7 kV is used to bombard the titanium dioxide target for 20 minutes to deposit a layer of TiO on the substrate by sputtering. 2 Thin film, then bombard the germanium target under the same conditions for 10min, and sputter deposit a layer o...
example 3
[0020] The cleaning process of the required quartz substrate and target material during the preparation of the nanocomposite film is the same as in Example 1.
[0021] Fix the cleaned quartz substrate and target on the substrate and target in the sputtering vacuum chamber respectively, and evacuate to make the background vacuum degree reach 8.0×10 -4 Pa, and then pass into the sputtering chamber argon gas with a purity of 99.99%, so that the pressure in the sputtering chamber is 2.0×10 -2 Pa, adjust the temperature in the sputtering chamber to 200°C. The pre-sputtering cleaning process of the quartz substrate and target is the same as in Example 1. Firstly, an argon ion beam with an extraction current of 30mA and an extraction voltage of 1.0kV is used to bombard the titanium dioxide target for 20 minutes to deposit a layer of TiO on the substrate by sputtering. 2 Thin film, then bombard the germanium target for 6min under the same conditions, and sputter deposit a layer of G...
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