Protective film composition for wafer dicing

Abstract

Disclosed is a protective film composition for wafer dicing, comprising at least one resin selected from the group consisting of polyethyloxazoline and polyvinylpyrrolidone, at least one component selected from the group consisting of a water-soluble resin and an alcoholic monomer, and a solvent, such as water or a mixture of water and an organic solvent.

Description

technical field [0001] The invention relates to a protective film composition with excellent thermal stability, which is applied to a semiconductor cutting process. Background technique [0002] In the manufacture of semiconductor devices, a wafer dicing process follows a semiconductor lamination process in order to separate a plurality of devices respectively arranged by dicing the wafer along boundary regions between the devices called streets. After the dicing process, a chip processing process is performed, thereby completing a semiconductor product. [0003] As the integration of semiconductor devices increases, the width of the track becomes narrower, and the mechanical properties of the laminate become worse. Therefore, it is necessary to change the wafer dicing process to solve the above-mentioned problems. [0004] As the degree of integration of devices increases, polyimide, a main substance in an insulating film at an uppermost position of a laminate, may be dam...

AI Technical Summary

Problems solved by technology

When a wafer is cut with a blade, in the case where the wafer protective film has a high hardness, the protective film may be cracked, so that impurities generated during wafer dicing may penetrate into the voids of the cracked film

Since these water-insoluble impurities stick to the upper surface of the wafer, they are not washed away by water and become defects